Xilinx Inc. XC17S10XLPD8C
- Part Number:
- XC17S10XLPD8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730370-XC17S10XLPD8C
- Description:
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Datasheet:
- XC17S10XLPD8C
Xilinx Inc. XC17S10XLPD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S10XLPD8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reach Compliance Codenot_compliant
- Base Part NumberXC17S10XL
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size100kb
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.005mA
- Organization95752X1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density95752 bit
- I/O TypeCOMMON
- Memory IC TypeMEMORY CIRCUIT
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S10XLPD8C Overview
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Tube external packaging.A qualified individual to operate within 0°C~70°C is required.OTP allows for programmability.The voltage is 3V~3.6V.FPGA is mounted in Through Hole.Data storage is limited to a size of 100kb bytes.For other related parts, search "XC17S10XL".The supply voltage is 3.3V.FPGA is possible to connect different functions on the 8 axis at different terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.This is a MEMORY CIRCUIT memory chip.The 8 pins are on the board.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.With the part are included 8 pins.Taking the speed of the IC into consideration, this is a memory IC that can work at a frequency of 10MHz.In the memory, the I/O configuration has been set to COMMON.The best power supply to use is a 3.3V power supply, which is highly recommended.
XC17S10XLPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLPD8C Applications
There are a lot of Xilinx Inc. XC17S10XLPD8C applications of configuration proms for FPGAs.
cell phones
nonvolatile BIOS memory
Cache memory
embedded logic
telecommunications
main computer memory
printers
networks
workstations,
data buffer
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Tube external packaging.A qualified individual to operate within 0°C~70°C is required.OTP allows for programmability.The voltage is 3V~3.6V.FPGA is mounted in Through Hole.Data storage is limited to a size of 100kb bytes.For other related parts, search "XC17S10XL".The supply voltage is 3.3V.FPGA is possible to connect different functions on the 8 axis at different terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.This is a MEMORY CIRCUIT memory chip.The 8 pins are on the board.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.With the part are included 8 pins.Taking the speed of the IC into consideration, this is a memory IC that can work at a frequency of 10MHz.In the memory, the I/O configuration has been set to COMMON.The best power supply to use is a 3.3V power supply, which is highly recommended.
XC17S10XLPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLPD8C Applications
There are a lot of Xilinx Inc. XC17S10XLPD8C applications of configuration proms for FPGAs.
cell phones
nonvolatile BIOS memory
Cache memory
embedded logic
telecommunications
main computer memory
printers
networks
workstations,
data buffer
XC17S10XLPD8C More Descriptions
PROM Serial 93.5K-bit 3.3V 8-Pin PDIP / IC PROM PROG C-TEMP 3.3V 8-DIP
XC17S10XL EAR99 Tube 95752X1 ics fpga configuration 7.62mm 0.00005A 100kb 3.3V
Memory Circuit, 95752X1, CMOS, PDIP8
Product Description Demo for Development.
IC PROM PROG C-TEMP 3.3V 8-DIP
French Electronic Distributor since 1988
XC17S10XL EAR99 Tube 95752X1 ics fpga configuration 7.62mm 0.00005A 100kb 3.3V
Memory Circuit, 95752X1, CMOS, PDIP8
Product Description Demo for Development.
IC PROM PROG C-TEMP 3.3V 8-DIP
French Electronic Distributor since 1988
The three parts on the right have similar specifications to XC17S10XLPD8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchReach Compliance CodeBase Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeTerminal FinishAdditional FeatureHTS CodeTerminal FormPeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Parallel/SerialPbfree CodeJESD-30 CodeView Compare
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XC17S10XLPD8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube1999e0ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL13.3V2.54mmnot_compliantXC17S10XL8Not Qualified3.6V3.3V3VOTP100kbSYNCHRONOUS10MHz0.005mA95752X13-STATE10.00005A95752 bitCOMMONMEMORY CIRCUIT4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead----------
-
Surface Mount20-LCC (J-Lead)YES20-40°C~85°CTube2000e0Obsolete3 (168 Hours)20EAR99CMOS3V~3.6VQUAD13.3V1.27mmnot_compliantXC17256EL20Not Qualified3.6V3.3V3VOTP256KbSYNCHRONOUS15MHz0.005mA256KX13-STATE10.00005A262144 bitCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS CompliantContains LeadTin/Lead (Sn85Pb15)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS8542.32.00.61J BEND22530SERIAL--
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0Obsolete3 (168 Hours)20-CMOS4.75V~5.25VQUAD15V1.27mmunknown-20COMMERCIAL5.25V-4.75VOTP36kbSYNCHRONOUS--36288X1-1-36288 bit-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS Compliant-TIN LEADUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-J BEND22530SERIALnoS-PQCC-J20
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL13.3V2.54mmnot_compliantXC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS--22530SERIAL--
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