Xilinx Inc. XC17S100APD8C

Name: XC17S100APD8C
Brand: Xilinx Inc.
SKU: 3246714-XC17S100APD8C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC17S100APD8C

Manufacturer:: Xilinx Inc.

Ventron No:: 3246714-XC17S100APD8C

Description:: IC PROM SER 100000 C-TEMP 8-DIP

ECAD Model:

Datasheet:: XC17S100APD8C

Specifications

Xilinx Inc. XC17S100APD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S100APD8C.

Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Surface Mount
NO
Number of Pins
8
Operating Temperature
0°C~70°C
Packaging
Tube
Published
1999
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Number of Terminations
8
ECCN Code
EAR99
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
2.54mm
Reflow Temperature-Max (s)
30
Base Part Number
XC17S100A
Pin Count
8
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
OTP
Supply Current-Max
0.015mA
Output Characteristics
3-STATE
Memory Width
1
Density
1 Mb
Standby Current-Max
0.001A
Parallel/Serial
SERIAL
I/O Type
COMMON
Memory IC Type
CONFIGURATION MEMORY
Height Seated (Max)
4.5974mm
Length
9.3599mm
Width
7.62mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead

Description

XC17S100APD8C Description
XC17S100APD8C developed by Xilinx Inc. is a type of OTP configuration PROM specifically designed to provide an easy-to-use, cost-effective method for storing Spartan-II/Spartan-IIE device configuration bitstreams. It is able to generate a configuration clock ro drive the Spartan PROM when the Spartan device operates in Master Serial mode. Based on the low-power CMOS floating gate process, it delivers high performance and strong reliability.

XC17S100APD8C Features
Low-power CMOS floating gate process 3.3V PROM Simple interface to the Spartan device Programmable reset polarity Configuration one-time programmable (OTP) read-only memory

XC17S100APD8C Applications
Electronic game consoles Electronic dictionaries

XC17S100APD8C More Descriptions

FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Configuration PROM, OTP, 863,840 bits for XC2S100E FPGA, 8-PDIP, Commercial
Configuration Memory, 781216X1, Serial, CMOS, PDSO20
XC17S100A EAR99 Tube 1999 ics fpga configuration 7.62mm 0.001A 1Mb 3.3V
PROM Serial 1M-bit 3.3V 8-Pin PDIP
IC PROM SER 100000 C-TEMP 8-DIP

Product Comparison

The three parts on the right have similar specifications to XC17S100APD8C.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Technology

Voltage - Supply

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Programmable Type

Supply Current-Max

Output Characteristics

Memory Width

Density

Standby Current-Max

Parallel/Serial

I/O Type

Memory IC Type

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

Lead Free

Additional Feature

Power Supplies

Voltage

Memory Size

Clock Frequency

Organization

Terminal Form

Reach Compliance Code

Qualification Status

Operating Mode

Memory Density

View Compare
XC17S100APD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

0°C~70°C

Tube

1999

e0

no

Obsolete

Not Applicable

8

EAR99

CMOS

3V~3.6V

DUAL

225

1

3.3V

2.54mm

30

XC17S100A

8

3.3V

3.6V

3V

OTP

0.015mA

3-STATE

1

1 Mb

0.001A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

No

Non-RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-
XC17256EPD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

0°C~70°C

Tube

2000

e0

-

Obsolete

Not Applicable

8

EAR99

CMOS

4.75V~5.25V

DUAL

225

1

5V

2.54mm

30

XC17256E

8

5V

-

-

OTP

0.01mA

3-STATE

1

256 kb

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

No

Non-RoHS Compliant

Contains Lead

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

5V

5V

256Kb

15MHz

256KX1

-

-

-

-

-

XC17S100APD8C vs XC17256EPD8C
XC17128EVO8I

Xilinx Inc.

Surface Mount

8-SOIC (0.154, 3.90mm Width)

YES

8

-40°C~85°C

Tube

2000

e0

-

Obsolete

1 (Unlimited)

8

EAR99

CMOS

4.5V~5.5V

DUAL

225

1

5V

1.27mm

30

XC17128E

8

-

5.5V

4.5V

OTP

0.01mA

3-STATE

1

-

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

-

4.9276mm

3.937mm

-

Non-RoHS Compliant

Contains Lead

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

5V

-

128kb

15MHz

-

GULL WING

not_compliant

Not Qualified

SYNCHRONOUS

131072 bit

XC17S100APD8C vs XC17128EVO8I
XC17128EPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

-

Obsolete

Not Applicable

8

EAR99

CMOS

4.5V~5.5V

DUAL

225

1

5V

2.54mm

30

XC17128E

8

-

5.5V

4.5V

OTP

0.01mA

3-STATE

1

-

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

-

Non-RoHS Compliant

Contains Lead

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

5V

-

128kb

15MHz

-

-

not_compliant

Not Qualified

SYNCHRONOUS

131072 bit

XC17S100APD8C vs XC17128EPD8I