Xilinx Inc. XC1765ESO8I
- Part Number:
- XC1765ESO8I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730421-XC1765ESO8I
- Description:
- IC SER CFG PROM 65K 8-SOIC
- Datasheet:
- XC1765ESO8I
Xilinx Inc. XC1765ESO8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC1765ESO8I.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature-40°C~85°C
- PackagingTube
- Published2000
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply4.5V~5.5V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage5V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC1765E
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)5.5V
- Power Supplies5V
- Supply Voltage-Min (Vsup)4.5V
- Programmable TypeOTP
- Memory Size65kb
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.01mA
- Organization64KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density65536 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)1.7272mm
- Length4.9276mm
- Width3.937mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC1765ESO8I Overview
FPGA uses a neat 8-SOIC (0.154, 3.90mm Width) package.Tube external packaging.-40°C~85°C license holder.This device can be programmed using OTP.A voltage of 4.5V~5.5V is applied to it.This memory device is mounted in Surface Mount.Currently, data storage can only store data up to 65kb bytes.Search "XC1765E" for related parts.The supply voltage should be 5V.A termination with different functions in the 8 axis.5.5V is the maximum voltage that can be used with this memory device.There must be a minimum voltage of 4.5V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.Reflow soldering should be done at no higher than 225 degrees.A 8 pin is included in it.Data is transmitted in this memory using a SERIAL process.The memory chip operates at a voltage of no more than 0.01mA.There is a set of 8 pins that are included with the part.There is a memory IC in this package that works at 10MHz frequencies.Memory is configured as COMMON for memory's I/O.Memory is recommended to use a 5V power supply.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.
XC1765ESO8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765ESO8I Applications
There are a lot of Xilinx Inc. XC1765ESO8I applications of configuration proms for FPGAs.
data buffer
cell phones
DVD disk buffer
networks
Cache memory
servers
eSRAM
eDRAM
mainframes
multimedia computers
FPGA uses a neat 8-SOIC (0.154, 3.90mm Width) package.Tube external packaging.-40°C~85°C license holder.This device can be programmed using OTP.A voltage of 4.5V~5.5V is applied to it.This memory device is mounted in Surface Mount.Currently, data storage can only store data up to 65kb bytes.Search "XC1765E" for related parts.The supply voltage should be 5V.A termination with different functions in the 8 axis.5.5V is the maximum voltage that can be used with this memory device.There must be a minimum voltage of 4.5V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.Reflow soldering should be done at no higher than 225 degrees.A 8 pin is included in it.Data is transmitted in this memory using a SERIAL process.The memory chip operates at a voltage of no more than 0.01mA.There is a set of 8 pins that are included with the part.There is a memory IC in this package that works at 10MHz frequencies.Memory is configured as COMMON for memory's I/O.Memory is recommended to use a 5V power supply.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.
XC1765ESO8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765ESO8I Applications
There are a lot of Xilinx Inc. XC1765ESO8I applications of configuration proms for FPGAs.
data buffer
cell phones
DVD disk buffer
networks
Cache memory
servers
eSRAM
eDRAM
mainframes
multimedia computers
XC1765ESO8I More Descriptions
Configuration Memory, 64KX1, Serial, CMOS, PDSO8
IC PROM SER I-TEMP 3.3V 8-DIP
IC SER CFG PROM 65K 8-SOIC
IC INTEGRATED CIRCUIT
IC PROM SER I-TEMP 3.3V 8-DIP
IC SER CFG PROM 65K 8-SOIC
IC INTEGRATED CIRCUIT
The three parts on the right have similar specifications to XC1765ESO8I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeOperating Supply VoltageVoltageDensityRadiation HardeningView Compare
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XC1765ESO8ISurface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0noObsolete1 (Unlimited)8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUALGULL WING22515V1.27mmnot_compliant30XC1765E8Not Qualified5.5V5V4.5VOTP65kbSYNCHRONOUS10MHz0.01mA64KX13-STATE10.00005A65536 bitSERIALCOMMONCONFIGURATION MEMORY1.7272mm4.9276mm3.937mmNon-RoHS CompliantContains Lead-----
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL-22513.3V2.54mmnot_compliant30XC1701L8Not Qualified3.6V3.3V3VOTP1MbSYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead----
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL-22515V2.54mm-30XC17256E8--5V-OTP256Kb-15MHz0.01mA256KX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead5V5V256 kbNo
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Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUALGULL WING22515V1.27mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mmNon-RoHS CompliantContains Lead----
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