Xilinx Inc. XC1736EPD8I

Name: XC1736EPD8I
Brand: Xilinx Inc.
SKU: 3246545-XC1736EPD8I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC1736EPD8I

Manufacturer:: Xilinx Inc.

Ventron No:: 3246545-XC1736EPD8I

Description:: IC PROM SER I-TEMP 36K 8-DIP

ECAD Model:

Datasheet:: XC1736EPD8I

Specifications

Xilinx Inc. XC1736EPD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC1736EPD8I.

Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Surface Mount
NO
Number of Pins
8
Operating Temperature
-40°C~85°C
Packaging
Tube
Published
2000
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Number of Terminations
8
ECCN Code
EAR99
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology
CMOS
Voltage - Supply
4.5V~5.5V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
5V
Terminal Pitch
2.54mm
Reflow Temperature-Max (s)
30
Base Part Number
XC1736E
Pin Count
8
Operating Supply Voltage
5V
Power Supplies
5V
Programmable Type
OTP
Memory Size
36kb
Clock Frequency
10MHz
Supply Current-Max
0.01mA
Output Characteristics
3-STATE
Memory Width
1
Standby Current-Max
0.00005A
Parallel/Serial
SERIAL
I/O Type
COMMON
Memory IC Type
CONFIGURATION MEMORY
Height Seated (Max)
4.5974mm
Length
9.3599mm
Width
7.62mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead

Description

XC1736EPD8I Overview
This component is manufactured by Xilinx Inc. and falls under the Memory - Configuration Proms for FPGAs category. It is specifically designed for FPGAs chips and is used as a memory configuration device. It is a Through Hole type, meaning it is mounted by inserting pins through holes on a circuit board. The operating temperature range for this part is -40°C to 85°C. It is packaged in a tube for protection during shipping and handling. This specific part is no longer in production and is considered obsolete. It falls under the EAR99 export control classification. The required supply voltage for this part is 4.5V to 5.5V. The peak reflow temperature for this component is 225 degrees Celsius. It has a length of 9.3599mm and is not radiation hardened.

XC1736EPD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC1736EPD8I Applications
There are a lot of Xilinx Inc. XC1736EPD8I applications of configuration proms for FPGAs.

servers
main computer memory
workstations,
nonvolatile BIOS memory
telecommunications
Cache memory
printers
supercomputers
cell phones
eDRAM

XC1736EPD8I More Descriptions

XC1700E series are available in 5V and 3.3V versions | IC PROM SER I-TEMP 36K 8-DIP
XC1736E EAR99 Tube 2000 ics fpga configuration 7.62mm 0.00005A 36kb 5V
PROM Serial 35.44K-bit 5V 8-Pin PDIP
Product Description Demo for Development.
IC PROM SER I-TEMP 36K 20-PLCC

Product Comparison

The three parts on the right have similar specifications to XC1736EPD8I.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Additional Feature

Technology

Voltage - Supply

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Operating Supply Voltage

Power Supplies

Programmable Type

Memory Size

Clock Frequency

Supply Current-Max

Output Characteristics

Memory Width

Standby Current-Max

Parallel/Serial

I/O Type

Memory IC Type

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

Lead Free

Pbfree Code

Terminal Finish

Terminal Form

Reach Compliance Code

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Operating Mode

Organization

Memory Density

View Compare
XC1736EPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

4.5V~5.5V

DUAL

225

1

5V

2.54mm

30

XC1736E

8

5V

5V

OTP

36kb

10MHz

0.01mA

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

No

Non-RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-
XC1736EPC20C

Xilinx Inc.

Surface Mount

20-LCC (J-Lead)

YES

-

0°C~70°C

Tube

-

e0

Obsolete

3 (168 Hours)

20

-

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

4.75V~5.25V

QUAD

225

1

5V

1.27mm

30

-

20

-

-

OTP

36kb

-

-

-

1

-

SERIAL

-

CONFIGURATION MEMORY

4.572mm

8.9662mm

8.9662mm

-

Non-RoHS Compliant

-

no

TIN LEAD

J BEND

unknown

S-PQCC-J20

COMMERCIAL

5.25V

4.75V

SYNCHRONOUS

36288X1

36288 bit

XC1736EPD8I vs XC1736EPC20C
XC17128ELPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

3V~3.6V

DUAL

225

1

3.3V

2.54mm

30

XC17128EL

8

-

3.3V

OTP

128kb

15MHz

0.005mA

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

-

Non-RoHS Compliant

Contains Lead

-

-

-

not_compliant

-

Not Qualified

3.6V

3V

SYNCHRONOUS

-

131072 bit

XC1736EPD8I vs XC17128ELPD8I
XC17128EPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

NO

8

-40°C~85°C

Tube

2000

e0

Obsolete

Not Applicable

8

EAR99

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

4.5V~5.5V

DUAL

225

1

5V

2.54mm

30

XC17128E

8

-

5V

OTP

128kb

15MHz

0.01mA

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

-

Non-RoHS Compliant

Contains Lead

-

-

-

not_compliant

-

Not Qualified

5.5V

4.5V

SYNCHRONOUS

-

131072 bit

XC1736EPD8I vs XC17128EPD8I