Xilinx Inc. XC17256EPDG8C
- Part Number:
- XC17256EPDG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3245609-XC17256EPDG8C
- Description:
- IC PROM SERIAL 256K 8-DIP
- Datasheet:
- Device Package User Guide
Xilinx Inc. XC17256EPDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17256EPDG8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published2004
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply4.75V~5.25V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)250
- Number of Functions1
- Supply Voltage5V
- Terminal Pitch2.54mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)30
- Base Part NumberXC17256E
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)5.25V
- Power Supplies5V
- Supply Voltage-Min (Vsup)4.75V
- Programmable TypeOTP
- Memory Size256Kb
- Operating ModeSYNCHRONOUS
- Clock Frequency15MHz
- Supply Current-Max0.01mA
- Organization256KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density262144 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusRoHS Compliant
XC17256EPDG8C Overview
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Packaging outside of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Using OTP, you can program it.The voltage fed to it is 4.75V~5.25V.The memory device is mounted in Through Hole.A data storage size of 256Kb is allowed.Other components related to "XC17256E" can also be found by searching the word.In order for it to function, it requires a voltage supply of 5V.A termination with different functions in the 8 axis.A maximum voltage of 5.25V can be applied to this memory device.4.75V is the minimum voltage required to supply the device.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.If you're reflow soldering, you shouldn't go above 250.There are 8 pins on it.As a result of the SERIAL process, data is transmitted from this memory.For the memory chip to operate, it requires a voltage not exceeding 0.01mA.There is a set of 8 pins included with the part.In terms of speed, this is a memory IC that operates at a 15MHz frequency.This memory has a COMMON configuration for its I/O.Memory is recommended to use a 5V power supply.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.
XC17256EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256EPDG8C Applications
There are a lot of Xilinx Inc. XC17256EPDG8C applications of configuration proms for FPGAs.
multimedia computers
graphics card
eDRAM
cell phones
printers
data buffer
hard disk drive (HDD)
eSRAM
telecommunications
personal computers
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Packaging outside of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Using OTP, you can program it.The voltage fed to it is 4.75V~5.25V.The memory device is mounted in Through Hole.A data storage size of 256Kb is allowed.Other components related to "XC17256E" can also be found by searching the word.In order for it to function, it requires a voltage supply of 5V.A termination with different functions in the 8 axis.A maximum voltage of 5.25V can be applied to this memory device.4.75V is the minimum voltage required to supply the device.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.If you're reflow soldering, you shouldn't go above 250.There are 8 pins on it.As a result of the SERIAL process, data is transmitted from this memory.For the memory chip to operate, it requires a voltage not exceeding 0.01mA.There is a set of 8 pins included with the part.In terms of speed, this is a memory IC that operates at a 15MHz frequency.This memory has a COMMON configuration for its I/O.Memory is recommended to use a 5V power supply.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.
XC17256EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256EPDG8C Applications
There are a lot of Xilinx Inc. XC17256EPDG8C applications of configuration proms for FPGAs.
multimedia computers
graphics card
eDRAM
cell phones
printers
data buffer
hard disk drive (HDD)
eSRAM
telecommunications
personal computers
XC17256EPDG8C More Descriptions
Voltage Regulators - Switching Regulators 36V 2.2MHz SD Cnvtr 2A w/ Low Op Crnt
Configuration Memory, 256KX1, Serial, CMOS, PDSO8
IC PROM SERIAL CONFIG 36K 8-SOIC
Configuration Memory, 256KX1, Serial, CMOS, PDSO8
IC PROM SERIAL CONFIG 36K 8-SOIC
The three parts on the right have similar specifications to XC17256EPDG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusOperating Supply VoltageVoltageDensityRadiation HardeningLead FreeTerminal FormView Compare
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XC17256EPDG8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2004e3yesObsolete1 (Unlimited)8EAR99Matte Tin (Sn)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL25015V2.54mmunknown30XC17256E8Not Qualified5.25V5V4.75VOTP256KbSYNCHRONOUS15MHz0.01mA256KX13-STATE10.00005A262144 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmRoHS Compliant-------
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Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL22515V2.54mm-30XC17256E8--5V-OTP256Kb-15MHz0.01mA256KX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant5V5V256 kbNoContains Lead-
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant----Contains Lead-
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUAL22515V1.27mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mmNon-RoHS Compliant----Contains LeadGULL WING
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