XC17256EPDG8C

Xilinx Inc. XC17256EPDG8C

Part Number:
XC17256EPDG8C
Manufacturer:
Xilinx Inc.
Ventron No:
3245609-XC17256EPDG8C
Description:
IC PROM SERIAL 256K 8-DIP
ECAD Model:
Datasheet:
Device Package User Guide

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Specifications
Xilinx Inc. XC17256EPDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17256EPDG8C.
  • Mounting Type
    Through Hole
  • Package / Case
    8-DIP (0.300, 7.62mm)
  • Surface Mount
    NO
  • Number of Pins
    8
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tube
  • Published
    2004
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
    CMOS
  • Voltage - Supply
    4.75V~5.25V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    250
  • Number of Functions
    1
  • Supply Voltage
    5V
  • Terminal Pitch
    2.54mm
  • Reach Compliance Code
    unknown
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC17256E
  • Pin Count
    8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.25V
  • Power Supplies
    5V
  • Supply Voltage-Min (Vsup)
    4.75V
  • Programmable Type
    OTP
  • Memory Size
    256Kb
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    15MHz
  • Supply Current-Max
    0.01mA
  • Organization
    256KX1
  • Output Characteristics
    3-STATE
  • Memory Width
    1
  • Standby Current-Max
    0.00005A
  • Memory Density
    262144 bit
  • Parallel/Serial
    SERIAL
  • I/O Type
    COMMON
  • Memory IC Type
    CONFIGURATION MEMORY
  • Height Seated (Max)
    4.5974mm
  • Length
    9.3599mm
  • Width
    7.62mm
  • RoHS Status
    RoHS Compliant
Description
XC17256EPDG8C Overview
FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Packaging outside of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Using OTP, you can program it.The voltage fed to it is 4.75V~5.25V.The memory device is mounted in Through Hole.A data storage size of 256Kb is allowed.Other components related to "XC17256E" can also be found by searching the word.In order for it to function, it requires a voltage supply of 5V.A termination with different functions in the 8 axis.A maximum voltage of 5.25V can be applied to this memory device.4.75V is the minimum voltage required to supply the device.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.If you're reflow soldering, you shouldn't go above 250.There are 8 pins on it.As a result of the SERIAL process, data is transmitted from this memory.For the memory chip to operate, it requires a voltage not exceeding 0.01mA.There is a set of 8 pins included with the part.In terms of speed, this is a memory IC that operates at a 15MHz frequency.This memory has a COMMON configuration for its I/O.Memory is recommended to use a 5V power supply.Thus, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included to better serve customers.

XC17256EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17256EPDG8C Applications
There are a lot of Xilinx Inc. XC17256EPDG8C applications of configuration proms for FPGAs.

multimedia computers
graphics card
eDRAM
cell phones
printers
data buffer
hard disk drive (HDD)
eSRAM
telecommunications
personal computers
XC17256EPDG8C More Descriptions
Voltage Regulators - Switching Regulators 36V 2.2MHz SD Cnvtr 2A w/ Low Op Crnt
Configuration Memory, 256KX1, Serial, CMOS, PDSO8
IC PROM SERIAL CONFIG 36K 8-SOIC
Product Comparison
The three parts on the right have similar specifications to XC17256EPDG8C.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Programmable Type
    Memory Size
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Organization
    Output Characteristics
    Memory Width
    Standby Current-Max
    Memory Density
    Parallel/Serial
    I/O Type
    Memory IC Type
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Operating Supply Voltage
    Voltage
    Density
    Radiation Hardening
    Lead Free
    Terminal Form
    View Compare
  • XC17256EPDG8C
    XC17256EPDG8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2004
    e3
    yes
    Obsolete
    1 (Unlimited)
    8
    EAR99
    Matte Tin (Sn)
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    DUAL
    250
    1
    5V
    2.54mm
    unknown
    30
    XC17256E
    8
    Not Qualified
    5.25V
    5V
    4.75V
    OTP
    256Kb
    SYNCHRONOUS
    15MHz
    0.01mA
    256KX1
    3-STATE
    1
    0.00005A
    262144 bit
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • XC17256EPD8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    -
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    DUAL
    225
    1
    5V
    2.54mm
    -
    30
    XC17256E
    8
    -
    -
    5V
    -
    OTP
    256Kb
    -
    15MHz
    0.01mA
    256KX1
    3-STATE
    1
    0.00005A
    -
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    5V
    5V
    256 kb
    No
    Contains Lead
    -
  • XC17128ELPD8I
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    -
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    not_compliant
    30
    XC17128EL
    8
    Not Qualified
    3.6V
    3.3V
    3V
    OTP
    128kb
    SYNCHRONOUS
    15MHz
    0.005mA
    -
    3-STATE
    1
    0.00005A
    131072 bit
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    -
    -
    -
    -
    Contains Lead
    -
  • XC17128EVO8I
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    YES
    8
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    1 (Unlimited)
    8
    EAR99
    -
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.5V~5.5V
    DUAL
    225
    1
    5V
    1.27mm
    not_compliant
    30
    XC17128E
    8
    Not Qualified
    5.5V
    5V
    4.5V
    OTP
    128kb
    SYNCHRONOUS
    15MHz
    0.01mA
    -
    3-STATE
    1
    0.00005A
    131072 bit
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    -
    4.9276mm
    3.937mm
    Non-RoHS Compliant
    -
    -
    -
    -
    Contains Lead
    GULL WING
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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