Winbond Electronics W966D6HBGX7I
- Part Number:
- W966D6HBGX7I
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3233178-W966D6HBGX7I
- Description:
- IC PSRAM 64MBIT 133MHZ 54VFBGA
- ECAD Model:
-
- Datasheet:
- W966D6HBGX7I
Winbond Electronics W966D6HBGX7I technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W966D6HBGX7I.
- Factory Lead Time14 Weeks
- Mounting TypeSurface Mount
- Package / Case54-VFBGA
- Number of Pins54
- Operating Temperature-40°C~85°C TC
- PackagingTube
- Published2015
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyPSRAM (Pseudo SRAM)
- Voltage - Supply1.7V~1.95V
- Memory Size64Mb 4M x 16
- Memory TypeVolatile
- Clock Frequency133MHz
- Access Time70ns
- Memory FormatPSRAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
W966D6HBGX7I Overview
The mounting type for this particular component is surface mount, making it easy to install and secure onto a circuit board. The package or case is a 54-VFBGA, providing a compact and efficient design. It has a wide operating temperature range of -40°C to 85°C TC, ensuring its reliability in various environments. The packaging is in a tube, making it convenient for storage and transportation. This component is also Pbfree, indicating that it does not contain any harmful lead materials. Its part status is active, meaning it is currently in production. The technology used is PSRAM (Pseudo SRAM), providing high-speed, low-power memory performance. It requires a voltage supply of 1.7V to 1.95V and has a memory size of 64Mb, specifically 4M x 16. Its memory format is PSRAM, making it suitable for a variety of applications.
W966D6HBGX7I Features
Package / Case: 54-VFBGA
54 Pins
W966D6HBGX7I Applications
There are a lot of Winbond Electronics
W966D6HBGX7I Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
The mounting type for this particular component is surface mount, making it easy to install and secure onto a circuit board. The package or case is a 54-VFBGA, providing a compact and efficient design. It has a wide operating temperature range of -40°C to 85°C TC, ensuring its reliability in various environments. The packaging is in a tube, making it convenient for storage and transportation. This component is also Pbfree, indicating that it does not contain any harmful lead materials. Its part status is active, meaning it is currently in production. The technology used is PSRAM (Pseudo SRAM), providing high-speed, low-power memory performance. It requires a voltage supply of 1.7V to 1.95V and has a memory size of 64Mb, specifically 4M x 16. Its memory format is PSRAM, making it suitable for a variety of applications.
W966D6HBGX7I Features
Package / Case: 54-VFBGA
54 Pins
W966D6HBGX7I Applications
There are a lot of Winbond Electronics
W966D6HBGX7I Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
W966D6HBGX7I More Descriptions
64Mbit Pseudo SDRAM, 4Mx16, Industrial 54 Ball VFBGA
IC PSRAM 64MBIT PARALLEL 54VFBGA
IC PSRAM 64MBIT PARALLEL 54VFBGA
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