Winbond Electronics W94AD2KBJX5E
- Part Number:
- W94AD2KBJX5E
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3233996-W94AD2KBJX5E
- Description:
- IC SDRAM 1GBIT 200MHZ 90VFBGA
- ECAD Model:
-
- Datasheet:
- W94AD2KBJX5E
Winbond Electronics W94AD2KBJX5E technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W94AD2KBJX5E.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case90-TFBGA
- Number of Pins90
- Operating Temperature-25°C~85°C TC
- PackagingTray
- Published2016
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- Additional FeatureAUTO/SELF REFRESH
- TechnologySDRAM - Mobile LPDDR
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Qualification StatusNot Qualified
- Operating Supply Voltage1.8V
- Supply Voltage-Max (Vsup)1.95V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size1Gb 32M x 32
- Number of Ports1
- Nominal Supply Current115mA
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency200MHz
- Access Time5ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization32MX32
- Output Characteristics3-STATE
- Memory Width32
- Write Cycle Time - Word, Page15ns
- Address Bus Width16b
- Density1 Gb
- Standby Current-Max0.00001A
- I/O TypeCOMMON
- Refresh Cycles8192
- Sequential Burst Length24816
- Interleaved Burst Length24816
- Height Seated (Max)1.025mm
- Length13mm
- RoHS StatusROHS3 Compliant
W94AD2KBJX5E Overview
This product has an operating temperature range of -25°C to 85°C and is packaged in a tray. It is currently an active product and has 90 terminations and 1 function. The memory size is 1Gb with a configuration of 32M x 32. The access time is 5ns and the memory interface is parallel. The write cycle time for word and page is 15ns. The maximum seated height is 1.025mm.
W94AD2KBJX5E Features
Package / Case: 90-TFBGA
90 Pins
Operating Supply Voltage:1.8V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W94AD2KBJX5E Applications
There are a lot of Winbond Electronics
W94AD2KBJX5E Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
This product has an operating temperature range of -25°C to 85°C and is packaged in a tray. It is currently an active product and has 90 terminations and 1 function. The memory size is 1Gb with a configuration of 32M x 32. The access time is 5ns and the memory interface is parallel. The write cycle time for word and page is 15ns. The maximum seated height is 1.025mm.
W94AD2KBJX5E Features
Package / Case: 90-TFBGA
90 Pins
Operating Supply Voltage:1.8V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W94AD2KBJX5E Applications
There are a lot of Winbond Electronics
W94AD2KBJX5E Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
W94AD2KBJX5E More Descriptions
LPDDR 32M*32 1.8V 90VFBGA 8*13mm 200MHz -25° ^ 85°C
IC DRAM 1GBIT PARALLEL 90VFBGA
IC DRAM 1GBIT PARALLEL 90VFBGA
The three parts on the right have similar specifications to W94AD2KBJX5E.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Qualification StatusOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsNominal Supply CurrentMemory TypeOperating ModeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthRoHS StatusReflow Temperature-Max (s)View Compare
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W94AD2KBJX5E10 WeeksSurface MountSurface Mount90-TFBGA90-25°C~85°C TCTray2016Active3 (168 Hours)90AUTO/SELF REFRESHSDRAM - Mobile LPDDR1.7V~1.95VBOTTOMNOT SPECIFIED11.8V0.8mmNOT SPECIFIEDNot Qualified1.8V1.95V1.7V1Gb 32M x 321115mAVolatileSYNCHRONOUS200MHz5nsDRAMParallel32MX323-STATE3215ns16b1 Gb0.00001ACOMMON819224816248161.025mm13mmROHS3 Compliant-- -
10 Weeks-Surface Mount60-TFBGA--40°C~85°C TCTape & Reel (TR)-Active3 (168 Hours)--SDRAM - Mobile LPDDR1.7V~1.95V----------1Gb 64M x 16--Volatile-200MHz5nsDRAMParallel---15ns---------ROHS3 Compliant-
-
10 WeeksSurface MountSurface Mount90-TFBGA90-40°C~85°C TCTray2016Active3 (168 Hours)90AUTO/SELF REFRESHSDRAM - Mobile LPDDR1.7V~1.95VBOTTOMNOT SPECIFIED11.8V0.8mm-Not Qualified1.8V1.95V1.7V1Gb 32M x 321115mAVolatileSYNCHRONOUS200MHz5nsDRAMParallel32MX323-STATE3215ns16b1 Gb0.00001ACOMMON819224816248161.025mm13mmROHS3 CompliantNOT SPECIFIED
-
10 Weeks-Surface Mount60-TFBGA--25°C~85°C TCTape & Reel (TR)-Active3 (168 Hours)--SDRAM - Mobile LPDDR1.7V~1.95V----------1Gb 64M x 16--Volatile-200MHz5nsDRAMParallel---15ns---------ROHS3 Compliant-
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