TSI572-10GCLV

IDT, Integrated Device Technology Inc TSI572-10GCLV

Part Number:
TSI572-10GCLV
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3771424-TSI572-10GCLV
Description:
IC SW SER RAPIDIO 399TEBGA
ECAD Model:
Datasheet:
TSI572 Prod Brief

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Specifications
IDT, Integrated Device Technology Inc TSI572-10GCLV technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc TSI572-10GCLV.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Package / Case
    BGA
  • Number of Pins
    399
  • Published
    2004
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3
  • Number of Terminations
    399
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.2V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    399
  • Operating Temperature (Max)
    70°C
  • Temperature Grade
    COMMERCIAL
  • Telecom IC Type
    TELECOM CIRCUIT
  • Height Seated (Max)
    2mm
  • Length
    21mm
  • Width
    21mm
  • Thickness
    1.81mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
TSI572-10GCLV Overview
The product was first published in 2004 and has been classified under the ECCN Code EAR99, indicating that it is eligible for export without a specific license. The terminal position is located at the bottom of the device, while the terminal form is in the shape of a ball. With only one function, this product operates on a supply voltage of 1.2V. The reflow temperature, although not specified, is within the commercial temperature grade. The maximum seated height of the product is 2mm and it has a length of 21mm. These specifications make it a compact and versatile device suitable for a variety of applications.

TSI572-10GCLV Features

TSI572-10GCLV Applications
There are a lot of Integrated Device Technology (IDT) TSI572-10GCLV Specialized ICs applications.

Secure Download and Boot
Reference Design License Management
IoT Node Authentication
DeviceNet Applications
PC-Based Instruments
Ecosystem Control
Secure Management of Limited Use Consumables
MP3 Players
Anti-cloning
Appliances requiring ErP Lot 6 compliance
TSI572-10GCLV More Descriptions
Serial RapidIO Switch 399-Pin TEBGA
Switch ICs - Various Serial Rapid IO Switch
IC SER RAPIDIO SWITCH 399TEPBGA
Product Comparison
The three parts on the right have similar specifications to TSI572-10GCLV.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Package / Case
    Number of Pins
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Reflow Temperature-Max (s)
    Pin Count
    Operating Temperature (Max)
    Temperature Grade
    Telecom IC Type
    Height Seated (Max)
    Length
    Width
    Thickness
    RoHS Status
    Lead Free
    Analog IC - Other Type
    Radiation Hardening
    Reach Compliance Code
    Operating Temperature (Min)
    Height
    Mounting Type
    Packaging
    Applications
    Base Part Number
    View Compare
  • TSI572-10GCLV
    TSI572-10GCLV
    10 Weeks
    Surface Mount
    BGA
    399
    2004
    e1
    yes
    Active
    3
    399
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    BOTTOM
    BALL
    260
    1
    1.2V
    NOT SPECIFIED
    399
    70°C
    COMMERCIAL
    TELECOM CIRCUIT
    2mm
    21mm
    21mm
    1.81mm
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • TSI577-10GCLV
    4 Weeks
    Surface Mount
    BGA
    399
    2011
    e1
    yes
    Active
    3
    399
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    BOTTOM
    BALL
    260
    1
    1.2V
    -
    399
    -
    -
    -
    -
    21mm
    21mm
    1.81mm
    RoHS Compliant
    Lead Free
    ANALOG CIRCUIT
    No
    -
    -
    -
    -
    -
    -
    -
  • TSI572-10GIL
    -
    Surface Mount
    -
    399
    2011
    e0
    no
    Active
    3
    399
    EAR99
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    225
    1
    1.2V
    NOT SPECIFIED
    399
    85°C
    INDUSTRIAL
    TELECOM CIRCUIT
    -
    21mm
    21mm
    1.81mm
    Non-RoHS Compliant
    Contains Lead
    -
    -
    not_compliant
    -40°C
    1.81mm
    -
    -
    -
    -
  • TSI574-10GCLV
    -
    -
    399-BGA Exposed Pad
    -
    -
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Surface Mount
    Tray
    Wireless Infrastructure
    IDTTSI574
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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