Texas Instruments TMS320VC5409AZGU16

TMS320VC5409AZGU16 Overview
The BGA package, also known as Ball Grid Array, is a popular choice for electronic components due to its compact size and high pin count. This particular BGA has 144 pins, making it suitable for complex circuits and high-speed data transfer. Weighing in at only 319.499126mg, it is lightweight and ideal for portable devices. With a Moisture Sensitivity Level (MSL) of 3, it can withstand moderate levels of humidity. Its operating temperature ranges from -40°C to 85°C, making it suitable for a wide range of environments. Additionally, this BGA requires a 3.3V supply and has a terminal form of balls. With a frequency of 160MHz and a low power mode, it is energy-efficient. It also has 0 UART channels, making it suitable for data transfer between devices.

TMS320VC5409AZGU16 Features
Supplied in the BGA package
Operating supply voltage of 3.3V
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics
4 external interrupts

TMS320VC5409AZGU16 Applications
There are a lot of Texas Instruments TMS320VC5409AZGU16 DSP applications.

Vibration signal processing
Biomedical engineering
Digital camera
Automatic analysis system of EEG or ECG
Finite impulse response digital filters
Voice recognition
Financial signals
Automobiles
Digital communications
Sound navigation and ranging systems