NXP USA Inc. SSTUH32864EC/G,551

Name: SSTUH32864EC/G,551
Brand: NXP USA Inc.
SKU: 3715854-SSTUH32864EC/G,551
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: SSTUH32864EC/G,551

Manufacturer:: NXP USA Inc.

Ventron No:: 3715854-SSTUH32864EC/G,551

Description:: IC BUFFER 1.8V 1/14BIT SOT536-1

ECAD Model:

Datasheet:: SSTUH32864EC/G,551

Specifications

NXP USA Inc. SSTUH32864EC/G,551 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SSTUH32864EC/G,551.

Mounting Type
Surface Mount
Package / Case
96-LFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2005
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
96
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
Base Part Number
74SSTUH32864
Pin Count
96
JESD-30 Code
R-PBGA-B96
Qualification Status
Not Qualified
Number of Bits
25, 14
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Configurable Registered Buffer
Output Polarity
COMPLEMENTARY
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Height Seated (Max)
1.5mm
Length
13.5mm
Width
5.5mm
RoHS Status
ROHS3 Compliant

Description

SSTUH32864EC/G,551 Overview
The surface mount technology has become increasingly popular in the electronics industry due to its compact size and ease of installation. However, when it comes to finding replacement parts, it can be challenging if the original part is obsolete. This is the case for the 74SSTUH32864, a 1:2 configurable registered buffer with complementary output polarity. Its terminal form is a ball, and it operates within a supply voltage range of 1.7V to 1.9V. Additionally, the reflow temperature-max (s) is 30, making it suitable for a variety of applications. Its JESD-30 code, R-PBGA-B96, indicates its package type, which is a plastic ball grid array. Despite its obsolete status, this part remains a reliable choice for CMOS technology.

SSTUH32864EC/G,551 Features

SSTUH32864EC/G,551 Applications
There are a lot of NXP USA Inc. SSTUH32864EC/G,551 Specialty Logic ICs applications.

Laser diode bonding
Car alarm systems
Portable radio
High-speed computer links
AV receiver
Wired telephone
Tuner
Clock radio
Sensor reporting
Televisions

SSTUH32864EC/G,551 More Descriptions

SSTU SERIES POSITIVE EDGE TRIGGERED D FLIP-FLOP COMPLEMENTARY OUTPUT PBGA96
IC BUFFER 1.8V 1/14BIT SOT536-1

Product Comparison

The three parts on the right have similar specifications to SSTUH32864EC/G,551.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

Number of Bits

Output Characteristics

Logic Type

Output Polarity

Trigger Type

Propagation Delay (tpd)

fmax-Min

Height Seated (Max)

Length

Width

RoHS Status

JESD-609 Code

Terminal Finish

Subcategory

Power Supplies

Mount

Number of Pins

Pbfree Code

ECCN Code

Max Operating Temperature

Min Operating Temperature

Frequency

Number of Outputs

Operating Supply Voltage

Number of Elements

Polarity

Max Supply Voltage

Min Supply Voltage

Nominal Supply Current

Propagation Delay

Turn On Delay Time

Logic Function

Logic IC Type

High Level Output Current

Low Level Output Current

Clock Edge Trigger Type

Thickness

Radiation Hardening

Lead Free

View Compare
SSTUH32864EC/G,551

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tray

2005

Obsolete

3 (168 Hours)

96

8542.39.00.01

CMOS

BOTTOM

BALL

260

1

1.7V~1.9V

0.8mm

30

74SSTUH32864

96

R-PBGA-B96

Not Qualified

25, 14

OPEN-DRAIN

1:2 Configurable Registered Buffer

COMPLEMENTARY

POSITIVE EDGE

1.8 ns

450 MHz

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
SSTUA32864EC/G,518

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tape & Reel (TR)

2007

Obsolete

2 (1 Year)

96

8542.39.00.01

-

BOTTOM

BALL

260

1

1.7V~2V

0.8mm

40

74SSTUA32864

96

R-PBGA-B96

Not Qualified

25, 14

-

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

1.8 ns

450 MHz

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SSTUH32864EC/G,551 vs SSTUA32864EC/G,518
SSTUA32866EC/G,557

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tray

2007

Obsolete

3 (168 Hours)

96

8542.39.00.01

CMOS

BOTTOM

BALL

260

1

1.7V~2V

0.8mm

30

74SSTUA32866

96

R-PBGA-B96

Not Qualified

25, 14

OPEN-DRAIN

1:1, 1:2 Configurable Registered Buffer with Parity

COMPLEMENTARY

POSITIVE EDGE

1.8 ns

450 MHz

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

e1

TIN SILVER COPPER

Other Logic ICs

1.8V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SSTUH32864EC/G,551 vs SSTUA32866EC/G,557
SSTUB32866BHLF

IDT, Integrated Device Technology Inc

-

-

-

-

-

2007

Discontinued

3

-

-

-

-

-

260

-

-

-

-

-

96

-

-

-

-

-

-

-

-

-

-

13.5mm

5.5mm

RoHS Compliant

e1

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

Surface Mount

96

yes

EAR99

70°C

0°C

410MHz

25

1.8V

1

Non-Inverting

1.9V

1.7V

40mA

1.9 ns

3 ns

Buffer

D FLIP-FLOP

-8mA

8mA

Positive Edge

1.4mm

No

Lead Free

SSTUH32864EC/G,551 vs SSTUB32866BHLF