SSTUB32864EC/G,518

NXP USA Inc. SSTUB32864EC/G,518

Part Number:
SSTUB32864EC/G,518
Manufacturer:
NXP USA Inc.
Ventron No:
3715763-SSTUB32864EC/G,518
Description:
IC REG BUFFER 25BIT 96-LFBGA
ECAD Model:
Datasheet:
SSTUB32864EC/G,518

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Specifications
NXP USA Inc. SSTUB32864EC/G,518 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SSTUB32864EC/G,518.
  • Mounting Type
    Surface Mount
  • Package / Case
    96-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2007
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    2 (1 Year)
  • Number of Terminations
    96
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.7V~2V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    74SSTUB32864
  • Pin Count
    96
  • JESD-30 Code
    R-PBGA-B96
  • Qualification Status
    Not Qualified
  • Number of Bits
    25, 14
  • Logic Type
    1:1, 1:2 Configurable Registered Buffer
  • Output Polarity
    COMPLEMENTARY
  • Trigger Type
    POSITIVE EDGE
  • Propagation Delay (tpd)
    1.5 ns
  • fmax-Min
    450 MHz
  • Height Seated (Max)
    1.5mm
  • Length
    13.5mm
  • Width
    5.5mm
  • RoHS Status
    ROHS3 Compliant
Description
SSTUB32864EC/G,518 Overview
The specific brand of this component is NXP USA Inc., a company that specializes in manufacturing Logic - Specialty Logic chips. This particular chip falls under the category of Logic - Specialty Logic. It is designed to operate within a temperature range of 0°C to 70°C. However, it is important to note that this part is considered obsolete, meaning it is no longer being actively produced or supported by the manufacturer. The HTS code, which is used for customs purposes, is 8542.39.00.01. The technology used in this chip is CMOS (Complementary Metal-Oxide-Semiconductor), a common technology employed in the manufacturing of integrated circuits. The terminal position of this chip is located at the bottom. This chip is capable of performing one specific function. The maximum temperature for reflow soldering is 40 seconds. It is worth mentioning that this chip has not been qualified, meaning it has not undergone the necessary testing and certification processes to ensure its performance and reliability. The minimum frequency at which this chip can operate is 450 MHz. Lastly, the maximum height when seated on a circuit board is 1.5mm.

SSTUB32864EC/G,518 Features


SSTUB32864EC/G,518 Applications
There are a lot of NXP USA Inc.
SSTUB32864EC/G,518 Specialty Logic ICs applications.


Wireless modems
Remote controls
Wireless network systems
Satellite communications networks
Ethernet circuitry
Wired telephone
Cordless telephone
Desktop PC
Notebook
Pocket PC
SSTUB32864EC/G,518 More Descriptions
Registered Buffer Single 25-CH CMOS 96-Pin LFBGA
IC REG BUFFER 25BIT 96-LFBGA
IC REG BUFFER 28BIT 160TFBGA
Product Comparison
The three parts on the right have similar specifications to SSTUB32864EC/G,518.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Qualification Status
    Number of Bits
    Logic Type
    Output Polarity
    Trigger Type
    Propagation Delay (tpd)
    fmax-Min
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    JESD-609 Code
    Terminal Finish
    Subcategory
    Power Supplies
    Output Characteristics
    View Compare
  • SSTUB32864EC/G,518
    SSTUB32864EC/G,518
    Surface Mount
    96-LFBGA
    YES
    0°C~70°C
    Tape & Reel (TR)
    2007
    Obsolete
    2 (1 Year)
    96
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    260
    1
    1.7V~2V
    0.8mm
    40
    74SSTUB32864
    96
    R-PBGA-B96
    Not Qualified
    25, 14
    1:1, 1:2 Configurable Registered Buffer
    COMPLEMENTARY
    POSITIVE EDGE
    1.5 ns
    450 MHz
    1.5mm
    13.5mm
    5.5mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • SSTU32865ET/G,518
    Surface Mount
    160-TFBGA
    -
    0°C~70°C
    Tape & Reel (TR)
    -
    Obsolete
    2 (1 Year)
    -
    -
    -
    -
    -
    -
    -
    1.7V~1.9V
    -
    -
    -
    -
    -
    -
    28
    1:2 Registered Buffer with Parity
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    160-TFBGA (9x13)
    -
    -
    -
    -
    -
  • SSTUA32864EC/G,557
    Surface Mount
    96-LFBGA
    YES
    0°C~70°C
    Tray
    2007
    Obsolete
    3 (168 Hours)
    96
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    260
    1
    1.7V~2V
    0.8mm
    30
    74SSTUA32864
    96
    R-PBGA-B96
    Not Qualified
    25, 14
    1:1, 1:2 Configurable Registered Buffer
    TRUE
    POSITIVE EDGE
    1.8 ns
    450 MHz
    1.5mm
    13.5mm
    5.5mm
    ROHS3 Compliant
    -
    e1
    TIN SILVER COPPER
    Other Logic ICs
    1.8V
    -
  • SSTUA32866EC/G,557
    Surface Mount
    96-LFBGA
    YES
    0°C~70°C
    Tray
    2007
    Obsolete
    3 (168 Hours)
    96
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    260
    1
    1.7V~2V
    0.8mm
    30
    74SSTUA32866
    96
    R-PBGA-B96
    Not Qualified
    25, 14
    1:1, 1:2 Configurable Registered Buffer with Parity
    COMPLEMENTARY
    POSITIVE EDGE
    1.8 ns
    450 MHz
    1.5mm
    13.5mm
    5.5mm
    ROHS3 Compliant
    -
    e1
    TIN SILVER COPPER
    Other Logic ICs
    1.8V
    OPEN-DRAIN
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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