Inphi Corporation SSIXF30011-875263

SSIXF30011-875263 Overview
This particular component is manufactured by Inphi Corporation and falls under the category of Interface - Telecom chips. It is designed to be mounted on the surface of a circuit board, using a surface mount technique. The package or casing of this chip is 868-BGA, which is a type of ball grid array packaging. It is supplied in a tray for packaging purposes. This specific model was first released in 2008 but is now considered obsolete. It has a moisture sensitivity level of 3, meaning it can withstand exposure to moisture for up to 168 hours. Its main function is as an Optical Transport Processor, used in telecommunications. This component is also compliant with the RoHS (Restriction of Hazardous Substances) standards.

SSIXF30011-875263 Features
Available in the 868-BGA package

SSIXF30011-875263 Applications
There are a lot of Inphi Corporation SSIXF30011-875263 Telecom applications.

DECT (Digital European Cordless Telephone) Base Stations
Wireless base stations
Fiber In The Loop (FITL)
Short/Medium Loop
Fiber Optic Terminals
Interfaces to SONET STS-1 Networks
E1 Multiplexer
Fiber in the loop (FITL)
Central office
Central office (CO)