NXP USA Inc. SPAKXC309VF100A

Name: SPAKXC309VF100A
Brand: NXP USA Inc.
SKU: 3821437-SPAKXC309VF100A
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: SPAKXC309VF100A

Manufacturer:: NXP USA Inc.

Ventron No:: 3821437-SPAKXC309VF100A

Description:: IC DSP 24BIT 100MHZ 196-MAPBGA

ECAD Model:

Datasheet:: DSP56303

Specifications

NXP USA Inc. SPAKXC309VF100A technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SPAKXC309VF100A.

Mounting Type
Surface Mount
Package / Case
196-LBGA
Surface Mount
YES
Operating Temperature
-40°C~105°C TJ
Packaging
Tray
Published
2005
Series
DSP563xx
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
196
ECCN Code
3A001.A.3
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
220
Supply Voltage
3.3V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
SPAKXC309
JESD-30 Code
S-PBGA-B196
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Interface
Host Interface, SSI, SCI
Clock Frequency
100MHz
Address Bus Width
18
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
24
Voltage - I/O
3.30V
Barrel Shifter
YES
Internal Bus Architecture
MULTIPLE
Non-Volatile Memory
ROM (576B)
On Chip Data RAM
24kB
Clock Rate
100MHz
Height Seated (Max)
1.6mm
Length
15mm
Width
15mm
RoHS Status
Non-RoHS Compliant

Description

SPAKXC309VF100A Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - DSP (Digital Signal Processors) chips. It is packaged in a tray and has a Moisture Sensitivity Level (MSL) of 3, meaning it can be exposed to moisture for up to 168 hours without causing damage. The recommended peak reflow temperature for this chip is 220 degrees Celsius. Its base part number is SPAKXC309 and it has a maximum supply voltage of 3.6V. The voltage for input/output is 3.30V and it has a clock rate of 100MHz. The maximum seated height for this chip is 1.6mm and it has a length of 15mm. It is not compliant with RoHS (Restriction of Hazardous Substances) regulations.

SPAKXC309VF100A Features
Supplied in the 196-LBGA package

SPAKXC309VF100A Applications
There are a lot of NXP USA Inc. SPAKXC309VF100A DSP applications.

MP3 audio player
Geophysical processing
Scene analysis technology
Finite impulse response digital filters
Airplanes
Sound navigation and ranging systems
TVs
Audio synthesis
Automatic analysis system of EEG or ECG
Audio

SPAKXC309VF100A More Descriptions

DSP Fixed-Point 24-Bit 100MHz 100MIPS 196-Pin MA-BGA
ON SEMICONDUCTOR - NGTB15N60S1EG - IGBT, 600V, 15A, W/ DIODE, TO-220-3
IC DSP 24BIT 100MHZ 196-MAPBGA
24-BIT 100 MHz OTHER DSP PBGA196

Product Comparison

The three parts on the right have similar specifications to SPAKXC309VF100A.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Clock Frequency

Address Bus Width

Boundary Scan

Low Power Mode

External Data Bus Width

Voltage - I/O

Barrel Shifter

Internal Bus Architecture

Non-Volatile Memory

On Chip Data RAM

Clock Rate

Height Seated (Max)

Length

Width

RoHS Status

Voltage - Core

Supplier Device Package

View Compare
SPAKXC309VF100A

NXP USA Inc.

Surface Mount

196-LBGA

YES

-40°C~105°C TJ

Tray

2005

DSP563xx

Obsolete

3 (168 Hours)

196

3A001.A.3

8542.31.00.01

CMOS

BOTTOM

BALL

220

3.3V

1mm

30

SPAKXC309

S-PBGA-B196

Not Qualified

3.6V

3V

Host Interface, SSI, SCI

100MHz

18

YES

YES

24

3.30V

YES

MULTIPLE

ROM (576B)

24kB

100MHz

1.6mm

15mm

15mm

Non-RoHS Compliant

-

-

-
SPAKDSP321VL275

NXP USA Inc.

Surface Mount

196-BGA

-

-40°C~105°C TJ

Tray

2005

DSP56K/Symphony

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

SPAKDSP321

-

-

-

-

Host Interface, SSI, SCI

-

-

-

-

-

3.30V

-

-

ROM (576B)

576kB

275MHz

-

-

-

ROHS3 Compliant

1.60V

-

SPAKXC309VF100A vs SPAKDSP321VL275
SPAKXCL307VL160

NXP USA Inc.

Surface Mount

196-LBGA

-

-40°C~100°C

Tray

2005

DSP563xx

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

SPAKXCL307

-

-

-

-

Host Interface, SSI, SCI

-

-

-

-

-

3.30V

-

-

ROM (576B)

576kB

160MHz

-

-

-

ROHS3 Compliant

1.80V

196-MAPBGA (15x15)

SPAKXC309VF100A vs SPAKXCL307VL160
SPAKDSP303VF100

NXP USA Inc.

Surface Mount

196-LBGA

-

-40°C~105°C TJ

Tray

2005

DSP563xx

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

SPAKDSP303

-

-

-

-

Host Interface, SSI, SCI

-

-

-

-

-

3.30V

-

-

ROM (576B)

24kB

100MHz

-

-

-

Non-RoHS Compliant

-

-

SPAKXC309VF100A vs SPAKDSP303VF100