SN75LVDS83DGGR

Texas Instruments SN75LVDS83DGGR

Part Number:
SN75LVDS83DGGR
Manufacturer:
Texas Instruments
Ventron No:
3172970-SN75LVDS83DGGR
Description:
IC FLATLINK(TM) XMITTER 56-TSSOP
ECAD Model:
Datasheet:
SN75LVDS83DGGR

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Specifications
Texas Instruments SN75LVDS83DGGR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments SN75LVDS83DGGR.
  • Lifecycle Status
    NRND (Last Updated: 1 day ago)
  • Contact Plating
    Gold
  • Mounting Type
    Surface Mount
  • Package / Case
    56-TFSOP (0.240, 6.10mm Width)
  • Surface Mount
    YES
  • Number of Pins
    56
  • Weight
    233.288226mg
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • Series
    FlatLink™
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    2 (1 Year)
  • Number of Terminations
    56
  • ECCN Code
    EAR99
  • Max Power Dissipation
    1.377W
  • Technology
    CMOS
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.5mm
  • Base Part Number
    75LVDS83
  • Pin Count
    56
  • Operating Supply Voltage
    3.3V
  • Nominal Supply Current
    110mA
  • Power Dissipation
    1.377W
  • Max Output Voltage
    454mV
  • Output Characteristics
    TOTEM-POLE
  • Differential Output
    YES
  • Output Polarity
    TRUE
  • Protocol
    LVDS
  • Input Characteristics
    STANDARD
  • Number of Drivers/Receivers
    5/0
  • Number of Drivers
    4
  • Supply Voltage1-Nom
    3.3V
  • Number of Receivers
    28
  • High Level Input Current-Max
    0.000025A
  • Height
    1.2mm
  • Length
    14mm
  • Width
    6.1mm
  • Thickness
    1.15mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
SN75LVDS83DGGR Overview
Our product boasts a surface mount feature, making it easy to install and suitable for a variety of applications. It is conveniently packaged in Tape & Reel (TR) format, ensuring safe and efficient transportation. The terminal form is GULL WING, providing a reliable connection for optimal performance. With a peak reflow temperature of 260 degrees Celsius, our product can withstand high temperature environments. It has a power dissipation of 1.377W and a maximum output voltage of 454mV, providing efficient power management. The output polarity is TRUE, ensuring accurate signal transmission. This product also includes 4 drivers and 28 receivers, making it suitable for complex systems. Additionally, the high level input current-max is 0.000025A, making it energy efficient and cost-effective.

SN75LVDS83DGGR Features
Tape & Reel (TR) package
56 pin count
56 pins
FlatLink? series

SN75LVDS83DGGR Applications
There are a lot of Texas Instruments SN75LVDS83DGGR Drivers/Receivers/Transceivers applications.

Wireless modems
Bridges
Bar, KTV wireless entertainment
Carrier phase observations
Cell phones
Aircraft positioning
TV signal transmission
Wireless communication
Remote controls
VoIP phones
SN75LVDS83DGGR More Descriptions
TEXAS INSTRUMENTS - SN75LVDS83DGGR - IC, FLATLINK TRANSMITTER, 3.6V, TSSOP-56, FULL REEL
EAR99 75LVDS83 Tape & Reel (TR) LVDS interface receiver 454mV 0.000025A 233.288226mg 1.377W
FlatLink™ Transmitter 56-TSSOP 0 to 70
LVDS Transmitter 0.454V 56-Pin TSSOP T/R
IC FLATLINK(TM) XMITTER 56-TSSOP
Display Interface FlatLink Transmitter
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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