NXP USA Inc. SE97TP/S900,547

Name: SE97TP/S900,547
Brand: NXP USA Inc.
SKU: 3750129-SE97TP/S900,547
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: SE97TP/S900,547

Manufacturer:: NXP USA Inc.

Ventron No:: 3750129-SE97TP/S900,547

Description:: IC TEMP SENSOR DIMM 3.3V 8-HWSON

ECAD Model:

Datasheet:: SE97TP/S900,547

Specifications

NXP USA Inc. SE97TP/S900,547 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SE97TP/S900,547.

Mounting Type
Surface Mount
Package / Case
8-WFDFN Exposed Pad
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Published
2009
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Voltage - Supply
3V~3.6V
Reach Compliance Code
unknown
Base Part Number
SE97
Function
Temp Monitoring System (Sensor), DIMM DDR Memory
Output Type
2-Wire Serial, I2C/SMBUS
Accuracy
±3°C
Topology
ADC (Sigma Delta), Comparator, Register Bank
Sensor Type
Internal
Output Alarm
Yes
Sensing Temperature
-40°C~125°C
RoHS Status
ROHS3 Compliant

Description

SE97TP/S900,547 Overview
Materials complied with Tape & Reel (TR)'s specifications.Thermal management? uses the output type 2-Wire Serial, I2C/SMBUS.8-WFDFN Exposed Pad is a well-known package among industry professionals because of its low cost.When acting as Temp Monitoring System (Sensor), DIMM DDR Memory, it can do so.Surface Mount-axis mounts it.Thermal management is incorporated wThermal managementh a Type of Internal.Maintaining a stable temperature of -40°C~125°C is essential to maintaining a reliable system.By providing 3V~3.6V Supply Voltage, you can ensure its normal operation.Using a thermometer, it is possible to determine the sensing temperature of -40°C~125°C.Based on the Base Part Number SE97, an item is classified as a Type, regardless of the package, temperature, or other variants.

SE97TP/S900,547 Features
Available in the 8-WFDFN Exposed Pad package

SE97TP/S900,547 Applications
There are a lot of NXP USA Inc. SE97TP/S900,547 applications of thermal management.

Low Acoustic Noise PCs
Power Supplies
Industrial Equipment
Laptops, Personal Computers and Servers
Multi-processor based equipment
DIMM Modules
Projectors
Telecommunications Equipment
Networking Equipment
Telecom Equipment

Product Comparison

The three parts on the right have similar specifications to SE97TP/S900,547.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Voltage - Supply

Reach Compliance Code

Base Part Number

Function

Output Type

Accuracy

Topology

Sensor Type

Output Alarm

Sensing Temperature

RoHS Status

Surface Mount

JESD-609 Code

Number of Terminations

Terminal Finish

Subcategory

Body Length or Diameter

Body Breadth

Power Supplies

Termination Type

Number of Bits

Sensors/Transducers Type

Housing

Output Interface Type

Body Height

View Compare
SE97TP/S900,547

NXP USA Inc.

Surface Mount

8-WFDFN Exposed Pad

-40°C~125°C

Tape & Reel (TR)

2009

Obsolete

3 (168 Hours)

3V~3.6V

unknown

SE97

Temp Monitoring System (Sensor), DIMM DDR Memory

2-Wire Serial, I2C/SMBUS

±3°C

ADC (Sigma Delta), Comparator, Register Bank

Internal

Yes

-40°C~125°C

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
SE97TL,147

NXP USA Inc.

Surface Mount

8-XFDFN Exposed Pad

-40°C~125°C

Tape & Reel (TR)

2009

Obsolete

1 (Unlimited)

3V~3.6V

unknown

SE97

Temp Monitoring System (Sensor), DIMM DDR Memory

I2C/SMBus

±3°C(Max)

ADC (Sigma Delta), Comparator, Register Bank

Internal

Yes

-40°C~125°C

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SE97TP/S900,547 vs SE97TL,147
SE97TK,118

NXP USA Inc.

Surface Mount

8-VFDFN Exposed Pad

-40°C~125°C

Cut Tape (CT)

2009

Obsolete

1 (Unlimited)

3V~3.6V

unknown

SE97

Temp Monitoring System (Sensor), DIMM DDR Memory

I2C/SMBus

±3°C(Max)

ADC (Sigma Delta), Comparator, Register Bank

Internal

Yes

-40°C~125°C

ROHS3 Compliant

YES

e4

8

Nickel/Palladium/Gold (Ni/Pd/Au)

Other Sensors

3mm

3 mm

1.8/3.3V

SOLDER

11

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

PLASTIC

2-WIRE INTERFACE

0.85mm

SE97TP/S900,547 vs SE97TK,118
SE97PW,118

NXP USA Inc.

Surface Mount

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

-40°C~125°C

Cut Tape (CT)

2009

Obsolete

1 (Unlimited)

3V~3.6V

-

SE97

Temp Monitoring System (Sensor), DIMM DDR Memory

I2C/SMBus

±3°C(Max)

ADC (Sigma Delta), Comparator, Register Bank

Internal

Yes

-40°C~125°C

ROHS3 Compliant

YES

e4

8

Nickel/Palladium/Gold (Ni/Pd/Au)

Other Sensors

4.4mm

3 mm

1.8/3.3V

SOLDER

11

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

PLASTIC

2-WIRE INTERFACE

1.1mm

SE97TP/S900,547 vs SE97PW,118