S29GL512P11FFI010

Cypress Semiconductor Corp S29GL512P11FFI010

Part Number:
S29GL512P11FFI010
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3230133-S29GL512P11FFI010
Description:
IC FLASH 512MBIT 110NS 64BGA
ECAD Model:
Datasheet:
S29GL512P11FFI010

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Specifications
Cypress Semiconductor Corp S29GL512P11FFI010 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S29GL512P11FFI010.
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    64-LBGA
  • Number of Pins
    64
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2012
  • Series
    GL-P
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • Termination
    SMD/SMT
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    512Mb 32M x 16
  • Nominal Supply Current
    110mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Data Bus Width
    8b
  • Organization
    512MX1
  • Memory Width
    1
  • Write Cycle Time - Word, Page
    110ns
  • Density
    512 Mb
  • Standby Current-Max
    0.000005A
  • Access Time (Max)
    110 ns
  • Sync/Async
    Asynchronous
  • Programming Voltage
    3V
  • Alternate Memory Width
    8
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    512
  • Sector Size
    128K
  • Page Size
    8/16words
  • Ready/Busy
    YES
  • Common Flash Interface
    YES
  • Height Seated (Max)
    1.4mm
  • Length
    13mm
  • Radiation Hardening
    No
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
S29GL512P11FFI010 Overview
Cypress Semiconductor Corp is a well-known brand in the semiconductor industry, known for its high-quality memory chips. As a part of the Memory category, this particular chip offers reliable and efficient performance for various electronic devices. One of the key parameters of this chip is its operating temperature range, which is -40°C to 85°C TA. This means that the chip can function effectively in extreme temperatures, making it suitable for use in a wide range of environments. Additionally, the chip has been assigned the JESD-609 Code of e1, indicating its compliance with industry standards and regulations. Another important parameter to consider is the termination of the chip, which is SMD/SMT. This type of termination allows for easy surface mounting onto a printed circuit board, making the chip suitable for use in compact and space-constrained devices. In terms of export control, the chip falls under ECCN Code 3A991.B.1.A, indicating that it is subject to certain restrictions and regulations. The chip has a voltage supply range of 2.7V to 3.6V, making it compatible with a wide range of power sources. This flexibility in voltage supply allows for the chip to be used in a variety of electronic devices without the need for additional voltage regulation. Another important parameter is the number of functions that the chip offers, which is 1. This means that the chip can perform a single specific function, making it ideal for use in specialized devices. Furthermore, the maximum supply voltage for this chip is 3.6V, ensuring that it operates within safe limits and does not get damaged due to overvoltage. The chip also features a toggle bit, indicating its ability to switch between two states. This makes it suitable for use in devices that require frequent switching between different modes or functions. Additionally, the chip has a ready/busy feature, which allows for efficient communication between the chip and the device it is used in. It is also worth noting that this particular chip is not radiation hardened, meaning it is not specifically designed to withstand high levels of radiation. This parameter may be important for certain applications, such as in space or military devices, where exposure to radiation is a concern. In conclusion, the Cypress Semiconductor Corp memory chip offers a wide range of parameters that make it a versatile and reliable choice for various electronic devices.

S29GL512P11FFI010 Features
Package / Case: 64-LBGA
64 Pins

S29GL512P11FFI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P11FFI010 Memory applications.

main computer memory
eDRAM
networking
networks
cell phones
hard disk drive (HDD)
DVD disk buffer
workstations,
graphics card
Camcorders
S29GL512P11FFI010 More Descriptions
NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray
GL-P Series 512 M (32 M x 16) 3.6 V 110 ns Surface Mount Flash Memory - FBGA-64
IC, SM FLASH 3V 512MB 110NS; Memory Type:Flash, NOR; Memory Size:512Mbit; Interface:Parallel; Memory Configuration:64M x 8bit or 32M x 16bit; Supply Voltage Range:2.7V to 3.6V; Memory IC Case Style:BGA; No. of Pins:64; Operating Temperature Range:-40°C to 85°C; Case Style:BGA; Access Time:110ns; Base Number:29; IC Generic Number:29GL512; Interface Type:Page Mode; Logic Function Number:29GL512; Max Operating Temperature:85°C; Max Supply Voltage:3.6V; Memory Size:512Mbit; Memory Voltage Vcc:3V; Min Supply Voltage:2.7V; Min Temperature Operating:-40°C; Packaging Type:Peel Pack; Page / Burst Read Access:25ns; Sector Type:Uniform; Termination Type:SMD; Voltage Vcc:3V
Product Comparison
The three parts on the right have similar specifications to S29GL512P11FFI010.
  • Image
    Part Number
    Manufacturer
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Termination
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Data Bus Width
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Access Time (Max)
    Sync/Async
    Programming Voltage
    Alternate Memory Width
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Page Size
    Ready/Busy
    Common Flash Interface
    Height Seated (Max)
    Length
    Radiation Hardening
    REACH SVHC
    RoHS Status
    Lead Free
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Width
    Factory Lead Time
    Access Time
    Address Bus Width
    Word Size
    Supplier Device Package
    View Compare
  • S29GL512P11FFI010
    S29GL512P11FFI010
    Copper, Silver, Tin
    Surface Mount
    Surface Mount
    64-LBGA
    64
    -40°C~85°C TA
    Tray
    2012
    GL-P
    e1
    Obsolete
    3 (168 Hours)
    64
    SMD/SMT
    3A991.B.1.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    3V
    1mm
    3.6V
    3/3.3V
    2.7V
    512Mb 32M x 16
    110mA
    Non-Volatile
    FLASH
    Parallel
    8b
    512MX1
    1
    110ns
    512 Mb
    0.000005A
    110 ns
    Asynchronous
    3V
    8
    YES
    YES
    YES
    512
    128K
    8/16words
    YES
    YES
    1.4mm
    13mm
    No
    No SVHC
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • S29GL01GP12FAI010
    -
    Surface Mount
    Surface Mount
    64-LBGA
    64
    -40°C~85°C TA
    Tray
    2015
    GL-P
    e0
    Obsolete
    3 (168 Hours)
    64
    -
    3A991.B.1.A
    TIN LEAD
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    3V
    1mm
    3.6V
    3/3.3V
    2.7V
    1Gb 128M x 8
    110mA
    Non-Volatile
    FLASH
    Parallel
    -
    1GX1
    1
    120ns
    1 Gb
    0.000005A
    120 ns
    Asynchronous
    3V
    8
    YES
    YES
    YES
    1K
    128K
    8/16words
    YES
    YES
    1.4mm
    13mm
    No
    -
    ROHS3 Compliant
    -
    240
    30
    11mm
    -
    -
    -
    -
    -
  • S29GL01GS10FHI010
    -
    Surface Mount
    Surface Mount
    64-LBGA
    64
    -40°C~85°C TA
    Tray
    2015
    GL-S
    e1
    Active
    3 (168 Hours)
    64
    -
    3A991.B.1.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    3V
    1mm
    3.6V
    3/3.3V
    2.7V
    1Gb 64M x 16
    60mA
    Non-Volatile
    FLASH
    Parallel
    -
    -
    16
    60ns
    1 Gb
    0.0001A
    -
    Asynchronous
    3V
    -
    YES
    YES
    YES
    1K
    64K
    32B
    YES
    YES
    1.4mm
    13mm
    No
    -
    ROHS3 Compliant
    -
    260
    40
    -
    13 Weeks
    100ns
    26b
    16b
    -
  • S29GL01GP13TFIH20D
    -
    -
    Surface Mount
    56-TFSOP (0.724, 18.40mm Width)
    -
    -40°C~85°C TA
    Tray
    2016
    GL-P
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    FLASH - NOR
    3V~3.6V
    -
    -
    -
    -
    -
    -
    -
    1Gb 128M x 8
    -
    Non-Volatile
    FLASH
    Parallel
    -
    -
    -
    130ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    130ns
    -
    -
    56-TSOP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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