Cypress Semiconductor Corp S29GL512P11FFI010
- Part Number:
- S29GL512P11FFI010
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3230133-S29GL512P11FFI010
- Description:
- IC FLASH 512MBIT 110NS 64BGA
- Datasheet:
- S29GL512P11FFI010
Cypress Semiconductor Corp S29GL512P11FFI010 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S29GL512P11FFI010.
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case64-LBGA
- Number of Pins64
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2012
- SeriesGL-P
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations64
- TerminationSMD/SMT
- ECCN Code3A991.B.1.A
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size512Mb 32M x 16
- Nominal Supply Current110mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Data Bus Width8b
- Organization512MX1
- Memory Width1
- Write Cycle Time - Word, Page110ns
- Density512 Mb
- Standby Current-Max0.000005A
- Access Time (Max)110 ns
- Sync/AsyncAsynchronous
- Programming Voltage3V
- Alternate Memory Width8
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size512
- Sector Size128K
- Page Size8/16words
- Ready/BusyYES
- Common Flash InterfaceYES
- Height Seated (Max)1.4mm
- Length13mm
- Radiation HardeningNo
- REACH SVHCNo SVHC
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
S29GL512P11FFI010 Overview
Cypress Semiconductor Corp is a well-known brand in the semiconductor industry, known for its high-quality memory chips. As a part of the Memory category, this particular chip offers reliable and efficient performance for various electronic devices. One of the key parameters of this chip is its operating temperature range, which is -40°C to 85°C TA. This means that the chip can function effectively in extreme temperatures, making it suitable for use in a wide range of environments. Additionally, the chip has been assigned the JESD-609 Code of e1, indicating its compliance with industry standards and regulations. Another important parameter to consider is the termination of the chip, which is SMD/SMT. This type of termination allows for easy surface mounting onto a printed circuit board, making the chip suitable for use in compact and space-constrained devices. In terms of export control, the chip falls under ECCN Code 3A991.B.1.A, indicating that it is subject to certain restrictions and regulations. The chip has a voltage supply range of 2.7V to 3.6V, making it compatible with a wide range of power sources. This flexibility in voltage supply allows for the chip to be used in a variety of electronic devices without the need for additional voltage regulation. Another important parameter is the number of functions that the chip offers, which is 1. This means that the chip can perform a single specific function, making it ideal for use in specialized devices. Furthermore, the maximum supply voltage for this chip is 3.6V, ensuring that it operates within safe limits and does not get damaged due to overvoltage. The chip also features a toggle bit, indicating its ability to switch between two states. This makes it suitable for use in devices that require frequent switching between different modes or functions. Additionally, the chip has a ready/busy feature, which allows for efficient communication between the chip and the device it is used in. It is also worth noting that this particular chip is not radiation hardened, meaning it is not specifically designed to withstand high levels of radiation. This parameter may be important for certain applications, such as in space or military devices, where exposure to radiation is a concern. In conclusion, the Cypress Semiconductor Corp memory chip offers a wide range of parameters that make it a versatile and reliable choice for various electronic devices.
S29GL512P11FFI010 Features
Package / Case: 64-LBGA
64 Pins
S29GL512P11FFI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P11FFI010 Memory applications.
main computer memory
eDRAM
networking
networks
cell phones
hard disk drive (HDD)
DVD disk buffer
workstations,
graphics card
Camcorders
Cypress Semiconductor Corp is a well-known brand in the semiconductor industry, known for its high-quality memory chips. As a part of the Memory category, this particular chip offers reliable and efficient performance for various electronic devices. One of the key parameters of this chip is its operating temperature range, which is -40°C to 85°C TA. This means that the chip can function effectively in extreme temperatures, making it suitable for use in a wide range of environments. Additionally, the chip has been assigned the JESD-609 Code of e1, indicating its compliance with industry standards and regulations. Another important parameter to consider is the termination of the chip, which is SMD/SMT. This type of termination allows for easy surface mounting onto a printed circuit board, making the chip suitable for use in compact and space-constrained devices. In terms of export control, the chip falls under ECCN Code 3A991.B.1.A, indicating that it is subject to certain restrictions and regulations. The chip has a voltage supply range of 2.7V to 3.6V, making it compatible with a wide range of power sources. This flexibility in voltage supply allows for the chip to be used in a variety of electronic devices without the need for additional voltage regulation. Another important parameter is the number of functions that the chip offers, which is 1. This means that the chip can perform a single specific function, making it ideal for use in specialized devices. Furthermore, the maximum supply voltage for this chip is 3.6V, ensuring that it operates within safe limits and does not get damaged due to overvoltage. The chip also features a toggle bit, indicating its ability to switch between two states. This makes it suitable for use in devices that require frequent switching between different modes or functions. Additionally, the chip has a ready/busy feature, which allows for efficient communication between the chip and the device it is used in. It is also worth noting that this particular chip is not radiation hardened, meaning it is not specifically designed to withstand high levels of radiation. This parameter may be important for certain applications, such as in space or military devices, where exposure to radiation is a concern. In conclusion, the Cypress Semiconductor Corp memory chip offers a wide range of parameters that make it a versatile and reliable choice for various electronic devices.
S29GL512P11FFI010 Features
Package / Case: 64-LBGA
64 Pins
S29GL512P11FFI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P11FFI010 Memory applications.
main computer memory
eDRAM
networking
networks
cell phones
hard disk drive (HDD)
DVD disk buffer
workstations,
graphics card
Camcorders
S29GL512P11FFI010 More Descriptions
NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray
GL-P Series 512 M (32 M x 16) 3.6 V 110 ns Surface Mount Flash Memory - FBGA-64
IC, SM FLASH 3V 512MB 110NS; Memory Type:Flash, NOR; Memory Size:512Mbit; Interface:Parallel; Memory Configuration:64M x 8bit or 32M x 16bit; Supply Voltage Range:2.7V to 3.6V; Memory IC Case Style:BGA; No. of Pins:64; Operating Temperature Range:-40°C to 85°C; Case Style:BGA; Access Time:110ns; Base Number:29; IC Generic Number:29GL512; Interface Type:Page Mode; Logic Function Number:29GL512; Max Operating Temperature:85°C; Max Supply Voltage:3.6V; Memory Size:512Mbit; Memory Voltage Vcc:3V; Min Supply Voltage:2.7V; Min Temperature Operating:-40°C; Packaging Type:Peel Pack; Page / Burst Read Access:25ns; Sector Type:Uniform; Termination Type:SMD; Voltage Vcc:3V
GL-P Series 512 M (32 M x 16) 3.6 V 110 ns Surface Mount Flash Memory - FBGA-64
IC, SM FLASH 3V 512MB 110NS; Memory Type:Flash, NOR; Memory Size:512Mbit; Interface:Parallel; Memory Configuration:64M x 8bit or 32M x 16bit; Supply Voltage Range:2.7V to 3.6V; Memory IC Case Style:BGA; No. of Pins:64; Operating Temperature Range:-40°C to 85°C; Case Style:BGA; Access Time:110ns; Base Number:29; IC Generic Number:29GL512; Interface Type:Page Mode; Logic Function Number:29GL512; Max Operating Temperature:85°C; Max Supply Voltage:3.6V; Memory Size:512Mbit; Memory Voltage Vcc:3V; Min Supply Voltage:2.7V; Min Temperature Operating:-40°C; Packaging Type:Peel Pack; Page / Burst Read Access:25ns; Sector Type:Uniform; Termination Type:SMD; Voltage Vcc:3V
The three parts on the right have similar specifications to S29GL512P11FFI010.
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ImagePart NumberManufacturerContact PlatingMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminationECCN CodeTerminal FinishHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceData Bus WidthOrganizationMemory WidthWrite Cycle Time - Word, PageDensityStandby Current-MaxAccess Time (Max)Sync/AsyncProgramming VoltageAlternate Memory WidthData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyCommon Flash InterfaceHeight Seated (Max)LengthRadiation HardeningREACH SVHCRoHS StatusLead FreePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)WidthFactory Lead TimeAccess TimeAddress Bus WidthWord SizeSupplier Device PackageView Compare
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S29GL512P11FFI010Copper, Silver, TinSurface MountSurface Mount64-LBGA64-40°C~85°C TATray2012GL-Pe1Obsolete3 (168 Hours)64SMD/SMT3A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM13V1mm3.6V3/3.3V2.7V512Mb 32M x 16110mANon-VolatileFLASHParallel8b512MX11110ns512 Mb0.000005A110 nsAsynchronous3V8YESYESYES512128K8/16wordsYESYES1.4mm13mmNoNo SVHCROHS3 CompliantLead Free---------
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-Surface MountSurface Mount64-LBGA64-40°C~85°C TATray2015GL-Pe0Obsolete3 (168 Hours)64-3A991.B.1.ATIN LEAD8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM13V1mm3.6V3/3.3V2.7V1Gb 128M x 8110mANon-VolatileFLASHParallel-1GX11120ns1 Gb0.000005A120 nsAsynchronous3V8YESYESYES1K128K8/16wordsYESYES1.4mm13mmNo-ROHS3 Compliant-2403011mm-----
-
-Surface MountSurface Mount64-LBGA64-40°C~85°C TATray2015GL-Se1Active3 (168 Hours)64-3A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM13V1mm3.6V3/3.3V2.7V1Gb 64M x 1660mANon-VolatileFLASHParallel--1660ns1 Gb0.0001A-Asynchronous3V-YESYESYES1K64K32BYESYES1.4mm13mmNo-ROHS3 Compliant-26040-13 Weeks100ns26b16b-
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--Surface Mount56-TFSOP (0.724, 18.40mm Width)--40°C~85°C TATray2016GL-P-Obsolete3 (168 Hours)-----FLASH - NOR3V~3.6V-------1Gb 128M x 8-Non-VolatileFLASHParallel---130ns------------------ROHS3 Compliant-----130ns--56-TSOP
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