Cypress Semiconductor Corp S29GL01GP11TFIR10D
- Part Number:
- S29GL01GP11TFIR10D
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3729843-S29GL01GP11TFIR10D
- Description:
- IC FLASH 1GBIT 110NS 56TSOP
- Datasheet:
- S29GL01GP11TFIR10D
Cypress Semiconductor Corp S29GL01GP11TFIR10D technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S29GL01GP11TFIR10D.
- Contact PlatingTin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case56-TFSOP (0.724, 18.40mm Width)
- Number of Pins56
- Supplier Device Package56-TSOP
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2016
- SeriesGL-P
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- TechnologyFLASH - NOR
- Voltage - Supply3V~3.6V
- InterfaceParallel
- Max Supply Voltage3.6V
- Min Supply Voltage3V
- Memory Size1Gb 128M x 8
- Memory TypeNon-Volatile
- Access Time110ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Write Cycle Time - Word, Page110ns
- Density1 Gb
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
S29GL01GP11TFIR10D Overview
The surface mount of the device is mounted on the surface of a circuit board, with a total of 56 pins. The supplier device package is 56-TSOP, and it is packaged in a tray. This product was published in 2016 and is part of the GL-P series. It has a minimum operating temperature of -40°C and requires a voltage supply of 3V to 3.6V. The memory interface is parallel, allowing for data to be transferred simultaneously. However, this device is not radiation hardened, meaning it is not resistant to radiation. Overall, this device is a compact and efficient option for electronic systems, but may not be suitable for use in environments with high levels of radiation.
S29GL01GP11TFIR10D Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins
S29GL01GP11TFIR10D Applications
There are a lot of Cypress Semiconductor Corp
S29GL01GP11TFIR10D Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
The surface mount of the device is mounted on the surface of a circuit board, with a total of 56 pins. The supplier device package is 56-TSOP, and it is packaged in a tray. This product was published in 2016 and is part of the GL-P series. It has a minimum operating temperature of -40°C and requires a voltage supply of 3V to 3.6V. The memory interface is parallel, allowing for data to be transferred simultaneously. However, this device is not radiation hardened, meaning it is not resistant to radiation. Overall, this device is a compact and efficient option for electronic systems, but may not be suitable for use in environments with high levels of radiation.
S29GL01GP11TFIR10D Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins
S29GL01GP11TFIR10D Applications
There are a lot of Cypress Semiconductor Corp
S29GL01GP11TFIR10D Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
S29GL01GP11TFIR10D More Descriptions
IC FLASH 1GBIT PARALLEL 56TSOP
The three parts on the right have similar specifications to S29GL01GP11TFIR10D.
-
ImagePart NumberManufacturerContact PlatingMountMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMax Supply VoltageMin Supply VoltageMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageDensityRadiation HardeningRoHS StatusFactory Lead TimeJESD-609 CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Supply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Nominal Supply CurrentMemory WidthAddress Bus WidthStandby Current-MaxSync/AsyncWord SizeProgramming VoltageData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyCommon Flash InterfaceHeight Seated (Max)LengthSurface MountTime@Peak Reflow Temperature-Max (s)Supply Current-MaxOrganizationAccess Time (Max)Alternate Memory WidthWidthView Compare
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S29GL01GP11TFIR10DTinSurface MountSurface Mount56-TFSOP (0.724, 18.40mm Width)5656-TSOP-40°C~85°C TATray2016GL-PObsolete3 (168 Hours)85°C-40°CFLASH - NOR3V~3.6VParallel3.6V3V1Gb 128M x 8Non-Volatile110nsFLASHParallel110ns1 GbNoROHS3 Compliant----------------------------------------
-
-Surface MountSurface Mount64-LBGA64--40°C~85°C TATray2015GL-SActive3 (168 Hours)--FLASH - NOR2.7V~3.6V---1Gb 64M x 16Non-Volatile100nsFLASHParallel60ns1 GbNoROHS3 Compliant13 Weekse1643A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51BOTTOM26013V1mm403.6V3/3.3V2.7V60mA1626b0.0001AAsynchronous16b3VYESYESYES1K64K32BYESYES1.4mm13mm-------
-
--Surface Mount64-LBGA64--40°C~85°C TATray2015GL-PObsolete3 (168 Hours)--FLASH - NOR1.65V~3.6V---1Gb 128M x 8Non-Volatile-FLASHParallel130ns1 GbNoROHS3 Compliant-e0643A991.B.1.ATIN LEAD8542.32.00.51BOTTOM24013V1mm-3.6V1.8/3.33/3.3V2.7V-1-0.000005A--3VYESYESYES1K128K8/16wordsYESYES1.4mm13mmYES300.11mA1GX1130 ns811mm
-
--Surface Mount56-TFSOP (0.724, 18.40mm Width)-56-TSOP-40°C~85°C TATray2016GL-PObsolete3 (168 Hours)--FLASH - NOR3V~3.6V---1Gb 128M x 8Non-Volatile130nsFLASHParallel130ns--ROHS3 Compliant---------------------------------------
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