MX25L6435EZNI-10G

Macronix MX25L6435EZNI-10G

Part Number:
MX25L6435EZNI-10G
Manufacturer:
Macronix
Ventron No:
3719388-MX25L6435EZNI-10G
Description:
IC FLASH 64MBIT 104MHZ 8WSON
ECAD Model:
Datasheet:
MX25L6435E

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Specifications
Macronix MX25L6435EZNI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6435EZNI-10G.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-WDFN Exposed Pad
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2014
  • Series
    MX25xxx35/36 - MXSMIO™
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Qualification Status
    Not Qualified
  • Power Supplies
    3/3.3V
  • Interface
    SPI, Serial
  • Memory Size
    64Mb 8M x 8
  • Memory Type
    Non-Volatile
  • Clock Frequency
    104MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Write Cycle Time - Word, Page
    300μs, 5ms
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
MX25L6435EZNI-10G Overview
The operating temperature range for the MX25xxx35/36 - MXSMIO™ series is -40°C to 85°C. This makes it suitable for use in a wide range of environments, even in extreme temperatures. The moisture sensitivity level (MSL) for these memory chips is 3, meaning they can withstand exposure to high levels of moisture for up to 168 hours without being damaged. The terminal finish for these chips is matte tin (Sn), which provides a reliable and durable surface for soldering. With a memory size of 64Mb and a memory format of FLASH, these chips offer ample storage capacity for various applications. The memory interface is SPI, allowing for efficient and fast data transfer. Additionally, the write cycle time for both word and page is 300μs and 5ms respectively, ensuring quick and efficient data writing. These chips also have a minimum data retention time of 20, making them reliable for long-term storage. Finally, they offer the option of write protection through both hardware and software, providing an added layer of security for sensitive data.

MX25L6435EZNI-10G Features
Package / Case: 8-WDFN Exposed Pad


MX25L6435EZNI-10G Applications
There are a lot of Macronix
MX25L6435EZNI-10G Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX25L6435EZNI-10G More Descriptions
MX25L Series 3 V 64 Mb (8M x 8) 104 MHz Industrial Grade Serial Flash - WSON-8
e3 Surface Mount Tray FLASH - NOR ic memory 104MHz 300mus 5ms 64Mb 8M x 8 3/3.3V
64Mbit SPI WSON-8(5x6) NOR FLASH ROHS
IC FLASH 64MBIT SPI 104MHZ 8WSON
Product Comparison
The three parts on the right have similar specifications to MX25L6435EZNI-10G.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Technology
    Voltage - Supply
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Qualification Status
    Power Supplies
    Interface
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    RoHS Status
    Lead Free
    Surface Mount
    Number of Pins
    Number of Terminations
    Additional Feature
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Programming Voltage
    Alternate Memory Width
    Height Seated (Max)
    Length
    Width
    ECCN Code
    HTS Code
    JESD-30 Code
    Operating Supply Voltage
    Supply Current-Max
    Density
    Standby Current-Max
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L6435EZNI-10G
    MX25L6435EZNI-10G
    16 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    -40°C~85°C TA
    Tray
    2014
    MX25xxx35/36 - MXSMIO™
    e3
    Not For New Designs
    3 (168 Hours)
    Matte Tin (Sn)
    FLASH - NOR
    2.7V~3.6V
    260
    40
    Not Qualified
    3/3.3V
    SPI, Serial
    64Mb 8M x 8
    Non-Volatile
    104MHz
    FLASH
    SPI
    300μs, 5ms
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    16 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    -40°C~85°C TA
    Tube
    -
    MX25xxx35/36 - MXSMIO™
    e3
    Active
    3 (168 Hours)
    MATTE TIN (800)
    FLASH - NOR
    2.7V~3.6V
    260
    40
    -
    -
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    104MHz
    FLASH
    SPI
    30μs, 1.5ms
    -
    -
    -
    -
    ROHS3 Compliant
    -
    YES
    16
    16
    CAN BE ORGNISED AS 128 MBIT X 1
    DUAL
    1
    3V
    1.27mm
    16
    3.6V
    2.7V
    SYNCHRONOUS
    32MX4
    4
    134217728 bit
    3V
    2
    2.65mm
    10.3mm
    7.52mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    10 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    -40°C~85°C TA
    Tray
    2010
    MX25xxx05/06
    -
    Active
    3 (168 Hours)
    -
    FLASH - NOR
    2.7V~3.6V
    NOT SPECIFIED
    NOT SPECIFIED
    Not Qualified
    3/3.3V
    SPI, Serial
    2Mb 256K x 8
    Non-Volatile
    86MHz
    FLASH
    SPI
    50μs, 3ms
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    ROHS3 Compliant
    Lead Free
    YES
    -
    8
    -
    DUAL
    1
    3V
    1.27mm
    8
    -
    2.7V
    SYNCHRONOUS
    1MX2
    2
    -
    2.7V
    1
    0.8mm
    6mm
    5mm
    EAR99
    8542.32.00.51
    R-PDSO-N8
    3.6V
    0.02mA
    2 Mb
    0.00001A
    -
    -
  • MX25L1606EM2I-12G
    16 Weeks
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    -40°C~85°C TA
    Tube
    2016
    MX25xxx05/06
    e3
    Not For New Designs
    3 (168 Hours)
    Matte Tin (Sn) - annealed
    FLASH - NOR
    2.7V~3.6V
    NOT SPECIFIED
    -
    Not Qualified
    3/3.3V
    SPI, Serial
    16Mb 2M x 8
    Non-Volatile
    86MHz
    FLASH
    SPI
    50μs, 3ms
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    ROHS3 Compliant
    Lead Free
    YES
    -
    8
    -
    DUAL
    1
    3V
    1.27mm
    8
    -
    2.7V
    SYNCHRONOUS
    8MX2
    2
    -
    2.7V
    1
    2.16mm
    5.28mm
    5.23mm
    EAR99
    8542.32.00.51
    R-PDSO-G8
    3.6V
    0.025mA
    16 Mb
    0.00002A
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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