Micron Technology Inc. MT29RZ4B2DZZHHWD-18I.84F
- Part Number:
- MT29RZ4B2DZZHHWD-18I.84F
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3721730-MT29RZ4B2DZZHHWD-18I.84F
- Description:
- IC FLASH 6G LPDDR2 6G 162VFBGA
- ECAD Model:
-
- Datasheet:
- MT29RZ4B2DZZHHWD-18I.84F
Micron Technology Inc. MT29RZ4B2DZZHHWD-18I.84F technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29RZ4B2DZZHHWD-18I.84F.
- Factory Lead Time6 Weeks
- Mounting TypeSurface Mount
- Package / Case162-VFBGA
- Supplier Device Package162-VFBGA (10.5x8)
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND, DRAM - LPDDR2
- Voltage - Supply1.8V
- Memory Size4Gb 128M x 32 N 2G 64M x 32 LPDDR2
- Memory TypeNon-Volatile
- Clock Frequency533MHz
- Memory FormatFLASH, RAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29RZ4B2DZZHHWD-18I.84F Overview
The mounting type for this particular electronic component is surface mount, meaning it is designed to be mounted directly onto a circuit board. The package or case for this component is a 162-VFBGA, which refers to the shape and size of the casing. It has an operating temperature range of -40°C to 85°C TA, making it suitable for use in a variety of environments. The component is packaged in a tray, which is a common method of packaging for electronic components. Its part status is active, indicating that it is currently in production. It has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to high levels of moisture. The memory size for this component is 4Gb, with a configuration of 128M x 32 N for LPDDR2 technology. It has a clock frequency of 533MHz and a parallel memory interface. Additionally, it is compliant with the ROHS3 standard, ensuring that it is environmentally friendly.
MT29RZ4B2DZZHHWD-18I.84F Features
Package / Case: 162-VFBGA
MT29RZ4B2DZZHHWD-18I.84F Applications
There are a lot of Micron Technology Inc.
MT29RZ4B2DZZHHWD-18I.84F Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
The mounting type for this particular electronic component is surface mount, meaning it is designed to be mounted directly onto a circuit board. The package or case for this component is a 162-VFBGA, which refers to the shape and size of the casing. It has an operating temperature range of -40°C to 85°C TA, making it suitable for use in a variety of environments. The component is packaged in a tray, which is a common method of packaging for electronic components. Its part status is active, indicating that it is currently in production. It has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to high levels of moisture. The memory size for this component is 4Gb, with a configuration of 128M x 32 N for LPDDR2 technology. It has a clock frequency of 533MHz and a parallel memory interface. Additionally, it is compliant with the ROHS3 standard, ensuring that it is environmentally friendly.
MT29RZ4B2DZZHHWD-18I.84F Features
Package / Case: 162-VFBGA
MT29RZ4B2DZZHHWD-18I.84F Applications
There are a lot of Micron Technology Inc.
MT29RZ4B2DZZHHWD-18I.84F Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT29RZ4B2DZZHHWD-18I.84F More Descriptions
Multichip Packages, NAND-Based MCP, 4Gb, LPDDR2 2Gb, 1.8V, 162-ball VFBGA, RoHSMicron SCT
MCP 128Mx32 Flash 64Mx32 LPDDR2 SDRAM 1.8V 162-Pin VFBGA
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
Active Non-Volatile ROHS3Compliant Parallel ic memory -40C~85C TA 1.8V 4Gb 128M x 32N 2G 64M x 32LPDDR2 533MHz
IC FLASH RAM 4GBIT PAR 162VFBGA
IC FLASH 6G LPDDR2 6G 162VFBGA
Multichip Packages MASSFLASH/LPDDR2 6G
IC FLASH RAM 4G PARALLEL 533MHZ
Flash Memory, 6Gbit, -40 To 85Deg C; Flash Memory Type:Nand With Mobile Lpddr2; Memory Configuration:6G X 1Bit; Interfaces:Parallel; Ic Case/Package:Vfbga; No. Of Pins:162Pins; Clock Frequency Max:533Mhz; Access Time:22Ns Rohs Compliant: Yes |Micron MT29RZ4B2DZZHHWD-18I.84F
MCP 128Mx32 Flash 64Mx32 LPDDR2 SDRAM 1.8V 162-Pin VFBGA
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
Active Non-Volatile ROHS3Compliant Parallel ic memory -40C~85C TA 1.8V 4Gb 128M x 32N 2G 64M x 32LPDDR2 533MHz
IC FLASH RAM 4GBIT PAR 162VFBGA
IC FLASH 6G LPDDR2 6G 162VFBGA
Multichip Packages MASSFLASH/LPDDR2 6G
IC FLASH RAM 4G PARALLEL 533MHZ
Flash Memory, 6Gbit, -40 To 85Deg C; Flash Memory Type:Nand With Mobile Lpddr2; Memory Configuration:6G X 1Bit; Interfaces:Parallel; Ic Case/Package:Vfbga; No. Of Pins:162Pins; Clock Frequency Max:533Mhz; Access Time:22Ns Rohs Compliant: Yes |Micron MT29RZ4B2DZZHHWD-18I.84F
The three parts on the right have similar specifications to MT29RZ4B2DZZHHWD-18I.84F.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSeriesSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29RZ4B2DZZHHWD-18I.84F6 WeeksSurface Mount162-VFBGA162-VFBGA (10.5x8)-40°C~85°C TATrayActive3 (168 Hours)FLASH - NAND, DRAM - LPDDR21.8V4Gb 128M x 32 N 2G 64M x 32 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 Compliant---------------------- -
-Surface Mount162-VFBGA--40°C~105°C TATape & Reel (TR)Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100--------------------
-
16 WeeksSurface Mount130-VFBGA--40°C~85°C TATrayActive-FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS Compliant-YES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
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-Surface Mount162-VFBGA--40°C~85°C TATrayLast Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel----------------------
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Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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