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MPC860TZQ50D4R2

NXP USA Inc. MPC860TZQ50D4R2

Part Number:
MPC860TZQ50D4R2
Manufacturer:
NXP USA Inc.
Ventron No:
3667472-MPC860TZQ50D4R2
Description:
IC MPU MPC8XX 50MHZ 357BGA
ECAD Model:
Datasheet:
MPC860TZQ50D4R2

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Specifications
NXP USA Inc. MPC860TZQ50D4R2 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860TZQ50D4R2.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    50MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860TZQ50D4R2 Overview
This particular component is manufactured by NXP USA Inc. and is classified as an Embedded - Microprocessors chip within the larger category of Embedded - Microprocessors. It is designed to operate within a temperature range of 0°C to 95°C and utilizes CMOS technology. The peak reflow temperature for this chip is 245°C and it has a terminal pitch of 1.27mm. The maximum reflow time is 30 seconds and it has a processing speed of 50MHz. The chip has a bit size of 32 and is equipped with Boundary Scan technology. Its format is FIXED POINT and it also has Co-Processors/DSP capabilities for Communications and CPM.

MPC860TZQ50D4R2 Features
32-Bit Structure

MPC860TZQ50D4R2 Applications
There are a lot of NXP USA Inc. MPC860TZQ50D4R2 Microprocessor applications.

Firewalls
Petrochemical
Industrial instrumentation devices
Pacemakers (used to control abnormal heart rhythm)
Hand-held metering systems
Monitoring-temperature level, oil level, speed, distance, acceleration
Radio
Auto-breaking system
Dialysis machines (performs function of liver)
Embedded gateways
MPC860TZQ50D4R2 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA T/R
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C
Microprocessors - MPU POWER QUICC
32-bit Communication Processors POWER QUICC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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