MPC860TCZQ50D4

NXP USA Inc. MPC860TCZQ50D4

Part Number:
MPC860TCZQ50D4
Manufacturer:
NXP USA Inc.
Ventron No:
3667578-MPC860TCZQ50D4
Description:
IC MPU MPC8XX 50MHZ 357BGA
ECAD Model:
Datasheet:
MPC860TCZQ50D4

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Specifications
NXP USA Inc. MPC860TCZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860TCZQ50D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead/Silver (Sn/Pb/Ag)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    50MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860TCZQ50D4 Description
The JESD-609 Code e0 technology, CMOS, is a powerful and efficient product designed for high-performance applications. With a peak reflow temperature of 245 degrees Celsius, this product can withstand extreme temperatures and maintain its functionality. It operates at a supply voltage of 3.3V, making it suitable for a wide range of electronic devices. The base part number, MPC860, ensures compatibility and reliability. The product also features a clock frequency of 50MHz, an address bus width of 32, and an external data bus width of 32, providing fast and reliable data transfer. Additionally, with a maximum seated height of 2.52mm, this product can easily fit into compact electronic systems.

MPC860TCZQ50D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) Communications Processor Module (CPM) Four Baud Rate Generators Four SCCs (Serial Communication Controllers)

MPC860TCZQ50D4 Applications
Communications equipment  Wireless infrastructure  Enterprise systems  Enterprise machine  Personal electronics  Portable electronics
MPC860TCZQ50D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357
MPU, 32BIT, 50MHZ, BGA-357; Series:MPC8xx; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:50MHz; Embedded Interface Type:Ethernet, I2C, SPI, UART; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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