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Microchip Technology MCP6L72T-E/SN

Part Number:

MCP6L72T-E/SN

Manufacturer:

Microchip Technology

Ventron No:

3689135-MCP6L72T-E/SN

Description:

IC OPAMP GP 2MHZ RRO 8SOIC

Datasheet:

MCP6L72T-E/SN

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Part Overview

Description
The MCP6L71/1R/2/4 family of operational amplifiers (op amps) from Microchip Technology Inc. is designed for general-purpose applications. They feature a combination of rail-to-rail input and output, low quiescent current, and bandwidth that make them suitable for a wide range of applications.

Features
Gain Bandwidth Product: 2 MHz (typical)
Supply Current: 150 μA (typical)
Supply Voltage: 2.0V to 6.0V
Rail-to-Rail Input/Output
Extended Temperature Range: -40°C to 125°C
Available in Single, Dual, and Quad Packages

Applications
Portable Equipment
Photodiode Amplifier
Analog Filters
Notebooks and PDAs
Battery-Powered Systems

Specifications

Microchip Technology MCP6L72T-E/SN technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology MCP6L72T-E/SN.

  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SOIC (0.154, 3.90mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2009
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Subcategory
    Operational Amplifier
  • Packing Method
    TAPE AND REEL
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    2
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MCP6L72
  • Pin Count
    8
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Rail-to-Rail
  • Power Supplies
    5V
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    2
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    2
  • Nominal Supply Current
    150μA
  • Output Current

    Output Current is the maximum amount of current that an electronic component can deliver to a load without exceeding its specified operating limits. It is typically measured in amperes (A) or milliamperes (mA). Output Current is a critical parameter for selecting electronic components, as it determines the amount of power that the component can provide to a load.

    25mA
  • Slew Rate

    Slew rate is a measure of how quickly an electronic component's output voltage can change in response to a change in its input voltage. It is typically expressed in volts per microsecond (V/µs). A higher slew rate indicates that the component can respond more quickly to changes in its input voltage, which can be important in applications where fast signal processing is required.

    0.9V/μs
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    VOLTAGE-FEEDBACK
  • Amplifier Type

    Amplifier Type refers to the classification of amplifiers based on their circuit configuration and the type of transistors or other active devices used.

    General Purpose
  • Common Mode Rejection Ratio
    91 dB
  • Current - Input Bias
    1pA
  • Voltage - Supply, Single/Dual (±)
    2V~6V
  • Input Offset Voltage (Vos)

    Input Offset Voltage (Vos) is a parameter that specifies the voltage difference between the non-inverting and inverting inputs of an operational amplifier (op-amp) when the output voltage is zero. It represents the amount of voltage that must be applied to the inputs to bring the output to zero. Vos is caused by mismatches in the internal transistors of the op-amp and can vary with temperature and other factors. A low Vos is desirable for precision applications where accurate signal processing is required.

    4mV
  • Bandwidth

    Bandwidth, in the context of electronic components, refers to the range of frequencies over which a component can operate effectively. It is typically measured in Hertz (Hz) and indicates the component's ability to pass signals within a specific frequency range without significant attenuation or distortion. A higher bandwidth indicates a wider range of frequencies that the component can handle, while a lower bandwidth indicates a narrower range. Bandwidth is a crucial parameter for components such as amplifiers, filters, and communication systems, as it determines the frequency range over which they can perform their intended functions.

    2MHz
  • Unity Gain BW-Nom
    2000 kHz
  • Voltage Gain
    105dB
  • Low-Offset
    NO
  • Frequency Compensation
    YES
  • Supply Voltage Limit-Max
    7V
  • Voltage - Input Offset
    1mV
  • Low-Bias
    YES
  • Micropower
    YES
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1.25mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4.9mm
  • Width
    3.9mm
  • Radiation Hardening
    No
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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