Micron Technology Inc. M28W160CB70N6E
- Part Number:
- M28W160CB70N6E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3835459-M28W160CB70N6E
- Description:
- IC FLASH 16MBIT 70NS 48TSOP
- ECAD Model:
-
- Datasheet:
- M28W160CT,CB
Micron Technology Inc. M28W160CB70N6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. M28W160CB70N6E.
- Mounting TypeSurface Mount
- Package / Case48-TFSOP (0.724, 18.40mm Width)
- Surface MountYES
- Number of Pins48
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published1998
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Additional FeatureBOTTOM BOOT BLOCK
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)30
- Base Part NumberM28W160
- Pin Count48
- Power Supplies3/3.3V
- Voltage2.7V
- Memory Size16Mb 1M x 16
- Nominal Supply Current20mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization1MX16
- Memory Width16
- Write Cycle Time - Word, Page70ns
- Address Bus Width20b
- Density16 Mb
- Standby Current-Max0.000006A
- Access Time (Max)70 ns
- Sync/AsyncAsynchronous
- Word Size16b
- Data PollingNO
- Toggle BitNO
- Command User InterfaceYES
- Number of Sectors/Size831
- Sector Size4K32K
- Boot BlockBOTTOM
- Common Flash InterfaceYES
- Height Seated (Max)1.2mm
- Length18.4mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
M28W160CB70N6E Overview
The Surface Mount technology used in this product ensures efficient and reliable assembly. With an ECCN Code of EAR99, it falls under the jurisdiction of the United States Department of Commerce. The HTS Code of 8542.32.00.51 further classifies it as a semiconductor device. The Reflow Temperature-Max (s) specification indicates that the maximum temperature during the reflow process should not exceed 30 degrees. The Base Part Number, M28W160, represents a specific model of memory chip with a capacity of 1MX16. The Write Cycle Time - Word, Page is 70ns, meaning that it can quickly write data to memory. This device operates in an asynchronous manner, allowing for flexible and independent communication. The Command User Interface feature enables easy and intuitive control. Lastly, it is important to note that this product is ROHS3 Compliant, adhering to international environmental standards.
M28W160CB70N6E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Additional Feature:BOTTOM BOOT BLOCK
M28W160CB70N6E Applications
There are a lot of Micron Technology Inc. M28W160CB70N6E Memory applications.
printers
main computer memory
embedded logic
multimedia computers
networking
eSRAM
eDRAM
personal digital assistants
networks
graphics card
The Surface Mount technology used in this product ensures efficient and reliable assembly. With an ECCN Code of EAR99, it falls under the jurisdiction of the United States Department of Commerce. The HTS Code of 8542.32.00.51 further classifies it as a semiconductor device. The Reflow Temperature-Max (s) specification indicates that the maximum temperature during the reflow process should not exceed 30 degrees. The Base Part Number, M28W160, represents a specific model of memory chip with a capacity of 1MX16. The Write Cycle Time - Word, Page is 70ns, meaning that it can quickly write data to memory. This device operates in an asynchronous manner, allowing for flexible and independent communication. The Command User Interface feature enables easy and intuitive control. Lastly, it is important to note that this product is ROHS3 Compliant, adhering to international environmental standards.
M28W160CB70N6E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Additional Feature:BOTTOM BOOT BLOCK
M28W160CB70N6E Applications
There are a lot of Micron Technology Inc. M28W160CB70N6E Memory applications.
printers
main computer memory
embedded logic
multimedia computers
networking
eSRAM
eDRAM
personal digital assistants
networks
graphics card
M28W160CB70N6E More Descriptions
QZEN .NOR Flash 16Mbit,bottom boot,1.65 to 3.6V,-40 to 85C,TSOP48
Flash Mem Parallel 3V/3.3V 16M-Bit 1M x 16 70ns 48-Pin TSOP Tray
NOR Flash, Legacy NOR Flash, 16Mb, 2.7V-3.6V, 48-pin TSOP, RoHSMicron SCT
FLASH, 16MBIT, 70NS, TSOP-48; Flash Memory Type:Parallel NOR; Memory Size:16Mbit; Flash Memory Configuration:1M x 16bit; IC Interface Type:Parallel; Memory Case Style:TSOP; No. of Pins:48Pins; Clock Frequency:-; Access Time:70ns RoHS Compliant: Yes
Flash Mem Parallel 3V/3.3V 16M-Bit 1M x 16 70ns 48-Pin TSOP Tray
NOR Flash, Legacy NOR Flash, 16Mb, 2.7V-3.6V, 48-pin TSOP, RoHSMicron SCT
FLASH, 16MBIT, 70NS, TSOP-48; Flash Memory Type:Parallel NOR; Memory Size:16Mbit; Flash Memory Configuration:1M x 16bit; IC Interface Type:Parallel; Memory Case Style:TSOP; No. of Pins:48Pins; Clock Frequency:-; Access Time:70ns RoHS Compliant: Yes
The three parts on the right have similar specifications to M28W160CB70N6E.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountPower SuppliesVoltageMemory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxAccess Time (Max)Sync/AsyncWord SizeData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizeBoot BlockCommon Flash InterfaceHeight Seated (Max)LengthRadiation HardeningRoHS StatusLead FreeSupplier Device PackageAccess TimeMax Operating TemperatureMin Operating TemperatureInterfaceView Compare
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M28W160CB70N6ESurface Mount48-TFSOP (0.724, 18.40mm Width)YES48-40°C~85°C TATray1998e3yesObsolete3 (168 Hours)48EAR99Matte Tin (Sn)BOTTOM BOOT BLOCK8542.32.00.51FLASH - NOR2.7V~3.6VDUAL26013V0.5mm30M28W160483/3.3V2.7V16Mb 1M x 1620mANon-VolatileFLASHParallel1MX161670ns20b16 Mb0.000006A70 nsAsynchronous16bNONOYES8314K32KBOTTOMYES1.2mm18.4mmNoROHS3 CompliantLead Free------ -
Surface Mount48-TFSOP (0.724, 18.40mm Width)---40°C~85°C TATape & Reel (TR)2016--Obsolete3 (168 Hours)-----FLASH - NOR2.7V~3.6V------M28W160---16Mb 1M x 16-Non-VolatileFLASHParallel--70ns----------------ROHS3 Compliant-48-TSOP70ns---
-
Surface Mount----40°C~85°C TATray2016--Obsolete3 (168 Hours)-----FLASH - NOR2.7V~3.6V------M28W160---16Mb 1M x 16-Non-VolatileFLASHParallel--70ns----------------ROHS3 Compliant--70ns85°C-40°CParallel
-
Surface Mount----40°C~85°C TATray2016--Obsolete3 (168 Hours)-----FLASH - NOR2.7V~3.6V------M28W160---16Mb 1M x 16-Non-VolatileFLASHParallel--70ns----------------ROHS3 Compliant--70ns85°C-40°CParallel
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