Lattice Semiconductor Corporation LFXP10E-4FN256I

LFXP10E-4FN256I Overview
The 256-BGA package/case of this product is designed to provide maximum protection and stability for its internal components. It is packaged in a tray for easy handling and transportation. This product was first published in 2007 and belongs to the XP series. Its terminal form is in the shape of a ball, allowing for efficient and reliable connections. The maximum reflow temperature for this product is 40 degrees Celsius. Its base part number is LFXP10 and it has a pin count of 256. With an impressive 188 outputs, this product is capable of handling multiple tasks at once. Its length measures 17mm, making it compact and suitable for various applications.

LFXP10E-4FN256I Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)

LFXP10E-4FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP10E-4FN256I FPGAs applications.

Medical ultrasounds
Cryptography
Aircraft navigation
DO-254
Automotive advanced driver assistance systems (ADAS)
Development Boards and Shields for Microcontrollers
Integrating multiple SPLDs
Data Mining
Industrial IoT
Artificial intelligence (AI)