NXP USA Inc. KMC8144SVT800B
- Part Number:
- KMC8144SVT800B
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3631849-KMC8144SVT800B
- Description:
- IC DSP 783FCBGA
- Datasheet:
- KMC8144SVT800B
NXP USA Inc. KMC8144SVT800B technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. KMC8144SVT800B.
- Mounting TypeSurface Mount
- Package / Case783-BBGA, FCBGA
- Supplier Device Package783-FCPBGA (29x29)
- Operating Temperature0°C~105°C TJ
- PackagingTray
- Published2006
- SeriesStarCore
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Base Part NumberMC8144
- InterfaceEBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
- Voltage - I/O3.30V
- Non-Volatile MemoryROM (96kB)
- Voltage - Core1.00V
- On Chip Data RAM10.5MB
- Clock Rate800MHz
- RoHS StatusROHS3 Compliant
KMC8144SVT800B Overview
The Surface Mount Mounting Type is commonly used for electronic components, such as the 783-BBGA package. This particular package is also known as the Flip Chip Ball Grid Array (FCBGA) and is used by various suppliers, with the 783-FCPBGA (29x29) being a popular option. It was first published in 2006 and has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. The interface for this package includes EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, and UTOPIA. It operates at a voltage of 3.30V for I/O, with a core voltage of 1.00V. Additionally, it has a non-volatile memory of 96kB and an on-chip data RAM of 10.5MB.
KMC8144SVT800B Features
Supplied in the 783-BBGA, FCBGA package
KMC8144SVT800B Applications
There are a lot of NXP USA Inc. KMC8144SVT800B DSP applications.
Spectral density estimation
Fourier transform
Automatic analysis system of EEG or ECG
Consumer electronic gadgets
Seismology
Voice recognition
Speech processing
Biometrics
Instrument modeling
Geophysical processing
The Surface Mount Mounting Type is commonly used for electronic components, such as the 783-BBGA package. This particular package is also known as the Flip Chip Ball Grid Array (FCBGA) and is used by various suppliers, with the 783-FCPBGA (29x29) being a popular option. It was first published in 2006 and has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. The interface for this package includes EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, and UTOPIA. It operates at a voltage of 3.30V for I/O, with a core voltage of 1.00V. Additionally, it has a non-volatile memory of 96kB and an on-chip data RAM of 10.5MB.
KMC8144SVT800B Features
Supplied in the 783-BBGA, FCBGA package
KMC8144SVT800B Applications
There are a lot of NXP USA Inc. KMC8144SVT800B DSP applications.
Spectral density estimation
Fourier transform
Automatic analysis system of EEG or ECG
Consumer electronic gadgets
Seismology
Voice recognition
Speech processing
Biometrics
Instrument modeling
Geophysical processing
KMC8144SVT800B More Descriptions
DSP 32-Bit 800MHz 800MIPS 783-Pin FCBGA
IC DSP 783FCPBGA
IC DSP 783FCPBGA
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
01 March 2024
TPS92662AQPHPRQ1 Alternatives, Characteristics, Functions and Other Details
Ⅰ. Introduction to TPS92662AQPHPRQ1Ⅱ. Characteristics of TPS92662AQPHPRQ1Ⅲ. Functions of TPS92662AQPHPRQ1Ⅳ. Circuit diagram of the TPS92662AQPHPRQ1Ⅴ. How reliable is the TPS92662AQPHPRQ1?Ⅵ. TPS92662AQPHPRQ1 technical parametersⅦ. How does TPS92662AQPHPRQ1 perform fault... -
01 March 2024
BCM89811B1AWMLG Manufacturer, Characteristics, Specifications and Purchase Guide
Ⅰ. Overview of BCM89811B1AWMLGⅡ. Manufacturer of BCM89811B1AWMLGⅢ. What are the characteristics of BCM89811B1AWMLG?Ⅳ. Where is BCM89811B1AWMLG used?Ⅴ. What is the connection method of BCM89811B1AWMLG?Ⅵ. Specifications of BCM89811B1AWMLGⅦ. Competitive... -
04 March 2024
NCP1377BDR2G Symbol, Operating Principle, Technical Parameters and More
Ⅰ. NCP1377BDR2G overviewⅡ. Symbol, footprint and pin configuration of NCP1377BDR2GⅢ. Operating principle of NCP1377BDR2GⅣ. Internal circuit architecture of NCP1377BDR2GⅤ. Precautions for the use of NCP1377BDR2GⅥ. Technical parameters of... -
04 March 2024
ADS1248IPWR Specifications, Characteristics, Applications and Market Trends
Ⅰ. Introduction to ADS1248IPWRⅡ. Specifications of ADS1248IPWRⅢ. Functional block diagram of ADS1248IPWRⅣ. Characteristics of ADS1248IPWRⅤ. Where is ADS1248IPWR used?Ⅵ. Absolute maximum ratings of ADS1248IPWRⅦ. Market trends of ADS1248IPWRⅧ....
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.