KMC8112TMP2400V

NXP USA Inc. KMC8112TMP2400V

Part Number:
KMC8112TMP2400V
Manufacturer:
NXP USA Inc.
Ventron No:
3631921-KMC8112TMP2400V
Description:
IC DSP 300MHZ 431FCBGA
ECAD Model:
Datasheet:
KMC8112TMP2400V

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Specifications
NXP USA Inc. KMC8112TMP2400V technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. KMC8112TMP2400V.
  • Mounting Type
    Surface Mount
  • Package / Case
    431-BFBGA, FCBGA
  • Supplier Device Package
    431-FCPBGA (20x20)
  • Operating Temperature
    -40°C~105°C TJ
  • Packaging
    Tray
  • Published
    2006
  • Series
    StarCore
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Base Part Number
    MC8112
  • Interface
    Ethernet, I2C, TDM, UART
  • Voltage - I/O
    3.30V
  • Non-Volatile Memory
    External
  • Voltage - Core
    1.10V
  • On Chip Data RAM
    448kB
  • Clock Rate
    300MHz
  • RoHS Status
    Non-RoHS Compliant
Description
KMC8112TMP2400V Overview
The NXP USA Inc. Embedded - DSP (Digital Signal Processors) chip, published in 2006, is a 431-BFBGA, FCBGA package that is now obsolete. It has a Moisture Sensitivity Level (MSL) of 3 (168 Hours) and features an Ethernet, I2C, TDM, and UART interface. The voltage for I/O is 3.30V and the voltage for the core is 1.10V. With 448kB of on chip data RAM and a clock rate of 300MHz, this chip is Non-RoHS Compliant.

KMC8112TMP2400V Features
Supplied in the 431-BFBGA, FCBGA package

KMC8112TMP2400V Applications
There are a lot of NXP USA Inc. KMC8112TMP2400V DSP applications.

Airplanes
Encoding/broadcast
Speech processing
Voice recognition
Speech processing and recognition
Smart phones
Other sensor array processing
Digital hardware
Audio
Remote sensing image processing technology
KMC8112TMP2400V More Descriptions
DSP 32-Bit 300MHz 300MIPS 431-Pin FCBGA
IC DSP 300MHZ 431FCPBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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