ISSI, Integrated Silicon Solution Inc IS61QDP2B22M36A-333M3L
- Part Number:
- IS61QDP2B22M36A-333M3L
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3237558-IS61QDP2B22M36A-333M3L
- Description:
- IC SRAM 72MBIT 333MHZ 165BGA
- Datasheet:
- IS61QDP2B22M36A-333M3L
ISSI, Integrated Silicon Solution Inc IS61QDP2B22M36A-333M3L technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61QDP2B22M36A-333M3L.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case165-LBGA
- Surface MountYES
- Number of Pins165
- Operating Temperature0°C~70°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- ECCN Code3A991.B.2.A
- Additional FeaturePIPELINED ARCHITECTURE
- HTS Code8542.32.00.41
- TechnologySRAM - Synchronous, QUADP
- Voltage - Supply1.71V~1.89V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch1mm
- Pin Count165
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.89V
- Power Supplies1.5/1.81.8V
- Supply Voltage-Min (Vsup)1.71V
- Memory Size72Mb 2M x 36
- Memory TypeVolatile
- Clock Frequency333MHz
- Supply Current-Max1.2mA
- Access Time8.4ns
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization2MX36
- Output Characteristics3-STATE
- Memory Width36
- Standby Current-Max0.29A
- Memory Density75497472 bit
- I/O TypeSEPARATE
- Standby Voltage-Min1.7V
- Height Seated (Max)1.4mm
- Length17mm
- Width15mm
- RoHS StatusROHS3 Compliant
IS61QDP2B22M36A-333M3L Overview
The mounting type for this particular component is surface mount, making it suitable for placement on a circuit board. It has a total of 165 pins, allowing for a secure and stable connection. The operating temperature range for this component is 0°C to 70°C TA, ensuring its functionality in a variety of environments. With a moisture sensitivity level of 3 (168 hours), this component can withstand some exposure to moisture without compromising its performance. An additional feature of this component is its pipelined architecture, providing efficient data processing. It utilizes SRAM technology with a synchronous, QUADP design. The memory format is SRAM, and it has a parallel memory interface. With an organization of 2MX36 and a memory width of 36, this component is able to store and process a significant amount of data.
IS61QDP2B22M36A-333M3L Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE
IS61QDP2B22M36A-333M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61QDP2B22M36A-333M3L Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
The mounting type for this particular component is surface mount, making it suitable for placement on a circuit board. It has a total of 165 pins, allowing for a secure and stable connection. The operating temperature range for this component is 0°C to 70°C TA, ensuring its functionality in a variety of environments. With a moisture sensitivity level of 3 (168 hours), this component can withstand some exposure to moisture without compromising its performance. An additional feature of this component is its pipelined architecture, providing efficient data processing. It utilizes SRAM technology with a synchronous, QUADP design. The memory format is SRAM, and it has a parallel memory interface. With an organization of 2MX36 and a memory width of 36, this component is able to store and process a significant amount of data.
IS61QDP2B22M36A-333M3L Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE
IS61QDP2B22M36A-333M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61QDP2B22M36A-333M3L Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
IS61QDP2B22M36A-333M3L More Descriptions
SRAM - Synchronous, QUADP Memory IC 72Mb (2M x 36) Parallel 333 MHz 8.4 ns 165-LFBGA (15x17)
72Mb, Quadp (Burst Of 2), Sync Sram, 2M X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61QDP2B22M36A-333M3L
SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA
1.71V~1.89V 72Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 72MBIT PARALLEL 165LFBGA
SRAM 72Mb 2Mx36 333Mhz QUADP Sync SRAM
72Mb, Quadp (Burst Of 2), Sync Sram, 2M X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61QDP2B22M36A-333M3L
SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA
1.71V~1.89V 72Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 72MBIT PARALLEL 165LFBGA
SRAM 72Mb 2Mx36 333Mhz QUADP Sync SRAM
The three parts on the right have similar specifications to IS61QDP2B22M36A-333M3L.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityI/O TypeStandby Voltage-MinHeight Seated (Max)LengthWidthRoHS StatusPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Access Time (Max)Supplier Device PackageMax Operating TemperatureMin Operating TemperatureOperating Supply VoltageInterfaceMax Supply VoltageMin Supply VoltageNumber of PortsNominal Supply CurrentWrite Cycle Time - Word, PageAddress Bus WidthDensitySync/AsyncWord SizeRadiation HardeningView Compare
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IS61QDP2B22M36A-333M3L12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATrayActive3 (168 Hours)1653A991.B.2.APIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, QUADP1.71V~1.89VBOTTOM11.8V1mm165Not Qualified1.89V1.5/1.81.8V1.71V72Mb 2M x 36Volatile333MHz1.2mA8.4nsSRAMParallel2MX363-STATE360.29A75497472 bitSEPARATE1.7V1.4mm17mm15mmROHS3 Compliant-------------------
-
12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATrayActive3 (168 Hours)1653A991.B.2.APIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR II1.71V~1.89VBOTTOM11.8V1mm165-1.89V-1.71V72Mb 4M x 18Volatile250MHz--SRAMParallel4MX18-18-75497472 bit--1.4mm17mm15mmROHS3 CompliantNOT SPECIFIEDNOT SPECIFIED0.45 ns---------------
-
12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATrayActive3 (168 Hours)1653A991.B.2.APIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR II1.71V~1.89VBOTTOM11.8V1mm165-1.89V-1.71V72Mb 4M x 18Volatile300MHz--SRAMParallel4MX18-18-75497472 bit--1.4mm17mm15mmROHS3 CompliantNOT SPECIFIEDNOT SPECIFIED0.45 ns---------------
-
8 WeeksSurface Mount44-BSOJ (0.400, 10.16mm Width)-44-40°C~85°C TATape & Reel (TR)Active2 (1 Year)----SRAM - Asynchronous4.5V~5.5V---------4Mb 256K x 16Volatile--10nsSRAMParallel----------ROHS3 Compliant---44-SOJ85°C-40°C5VParallel5.5V4.5V150mA10ns18b4 MbAsynchronous16bNo
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