Altera EP4SGX70HF35C2N

EP4SGX70HF35C2N Overview
The packaging of electronic components is an essential aspect to consider in order to ensure their safe transport and proper functioning. One type of packaging commonly used is a tray, which provides a stable and secure environment for the components. Another important factor to consider is the Moisture Sensitivity Level (MSL) of the components, which is rated on a scale of 1 to 6. In this case, the MSL of the components is 3, meaning they can withstand exposure to ambient humidity for up to 168 hours. The Peak Reflow Temperature, measured in degrees Celsius, is 245, indicating the maximum temperature the components can withstand during the soldering process. Additionally, the terminal pitch, or distance between the terminals, is 1mm, allowing for efficient connectivity. With 488 outputs, these components are capable of handling a high volume of data. The power supplies required for these components are 0.91.2/31.52.5V, providing a wide range of voltage options. The clock frequency of these components is 800MHz, allowing for fast and efficient processing. With 72600 logic elements/cells, these components are highly complex and versatile. The total RAM bits, measuring 7564880, indicate the amount of memory storage available. Lastly, the width of these components is 35mm, making them compact and easy to integrate into various systems. Overall, these components are highly efficient and reliable, making them a valuable asset in the world of electronics.

EP4SGX70HF35C2N Features
488 I/Os
Up to 7564880 RAM bits

EP4SGX70HF35C2N Applications
There are a lot of Intel EP4SGX70HF35C2N FPGAs applications.

Medical imaging
Random logic
Industrial,Medical and Scientific Instruments
Device controllers
Development Boards and Shields for Microcontrollers
Software-defined radios
Medical ultrasounds
Computer hardware emulation
Telecommunication
Distributed Monetary Systems