Micron Technology Inc. EDW2032BBBG-60-F-D
- Part Number:
- EDW2032BBBG-60-F-D
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3246307-EDW2032BBBG-60-F-D
- Description:
- IC SGRAM 2GBIT 1.5GHZ 170FBGA
- ECAD Model:
-
- Datasheet:
- EDW2032BBBG-60-F-D
Micron Technology Inc. EDW2032BBBG-60-F-D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDW2032BBBG-60-F-D.
- Mounting TypeSurface Mount
- Package / Case170-TFBGA
- Number of Pins170
- Supplier Device Package170-FBGA (12x14)
- Operating Temperature0°C~95°C TC
- PackagingTray
- Published2015
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature95°C
- Min Operating Temperature0°C
- TechnologySGRAM - GDDR5
- Voltage - Supply1.31V~1.65V
- InterfaceParallel
- Memory Size2Gb 64M x 32
- Memory TypeVolatile
- Clock Frequency1.5GHz
- Memory FormatRAM
- Memory InterfaceParallel
- Data Bus Width32b
- Address Bus Width13b
- Density2 Gb
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
EDW2032BBBG-60-F-D Overview
The 170-TFBGA package/case features 170 pins and an operating temperature range of 0°C to 95°C TC. It is packaged in a tray and was first published in 2015. The maximum operating temperature for this product is 95°C, and the voltage supply ranges from 1.31V to 1.65V. The interface for this product is parallel, and it is classified as a volatile memory type. With a density of 2 Gb, this product offers high performance and reliability for a variety of applications. Its compact size and wide operating temperature range make it suitable for use in a wide range of electronic devices.
EDW2032BBBG-60-F-D Features
Package / Case: 170-TFBGA
170 Pins
EDW2032BBBG-60-F-D Applications
There are a lot of Micron Technology Inc.
EDW2032BBBG-60-F-D Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
The 170-TFBGA package/case features 170 pins and an operating temperature range of 0°C to 95°C TC. It is packaged in a tray and was first published in 2015. The maximum operating temperature for this product is 95°C, and the voltage supply ranges from 1.31V to 1.65V. The interface for this product is parallel, and it is classified as a volatile memory type. With a density of 2 Gb, this product offers high performance and reliability for a variety of applications. Its compact size and wide operating temperature range make it suitable for use in a wide range of electronic devices.
EDW2032BBBG-60-F-D Features
Package / Case: 170-TFBGA
170 Pins
EDW2032BBBG-60-F-D Applications
There are a lot of Micron Technology Inc.
EDW2032BBBG-60-F-D Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
EDW2032BBBG-60-F-D More Descriptions
DRAM Chip GDDR5 SGRAM 2G-Bit 64Mx32 1.35V/1.5V/1.6V 170-Pin FBGA Tray
IC EPROM 512K PARALLEL 28CDIP
IC RAM 2G PARALLEL 170FBGA
IC EPROM 512K PARALLEL 28CDIP
IC RAM 2G PARALLEL 170FBGA
The three parts on the right have similar specifications to EDW2032BBBG-60-F-D.
-
ImagePart NumberManufacturerMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceData Bus WidthAddress Bus WidthDensityRadiation HardeningRoHS StatusView Compare
-
EDW2032BBBG-60-F-DSurface Mount170-TFBGA170170-FBGA (12x14)0°C~95°C TCTray2015Obsolete3 (168 Hours)95°C0°CSGRAM - GDDR51.31V~1.65VParallel2Gb 64M x 32Volatile1.5GHzRAMParallel32b13b2 GbNoROHS3 Compliant- -
Surface Mount170-TFBGA--0°C~95°C TCTape & Reel (TR)2014Obsolete3 (168 Hours)--SGRAM - GDDR51.31V~1.65V-2Gb 64M x 32Volatile1.5GHzRAMParallel----ROHS3 Compliant
-
Surface Mount170-TFBGA170170-FBGA (12x14)0°C~95°C TCTray2014Obsolete3 (168 Hours)95°C0°CSGRAM - GDDR51.31V~1.65VParallel2Gb 64M x 32Volatile1.25GHzRAMParallel32b13b2 GbNoROHS3 Compliant
-
Surface Mount170-TFBGA170170-FBGA (12x14)0°C~95°C TCTray2014Obsolete3 (168 Hours)95°C0°CSGRAM - GDDR51.31V~1.65VParallel2Gb 64M x 32Volatile1.75GHzRAMParallel32b13b2 GbNoROHS3 Compliant
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
14 March 2024
Comprehensive Understanding of the 78M05 Chip
Ⅰ. Development history of linear voltage regulatorsⅡ. Introduction to 78M05Ⅲ. Pin layout of 78M05Ⅳ. External components of 78M05Ⅴ. Technical key points of 78M05Ⅵ. Internal circuit diagram of 78M05Ⅶ.... -
14 March 2024
What is the NE555 and How Does it Work?
Ⅰ. The birth background of NE555Ⅱ. Introduction to NE555Ⅲ. Design of NE555 timerⅣ. Internal composition of NE555Ⅴ. Operating modes of the NE555Ⅵ. Working principle of NE555Ⅶ. Application of... -
15 March 2024
ULN2003 Alternatives, Characteristics, Working Principle and Application
Ⅰ. ULN2003 overviewⅡ. What are the characteristics of ULN2003?Ⅲ. Pin diagram and functions of ULN2003Ⅳ. Working principle and function of ULN2003Ⅴ. ULN2003 drive circuit diagramⅥ. Where is ULN2003... -
15 March 2024
Detailed Explanation of 24C02 EEPROM Memory Chip
Ⅰ. Overview of 24C02Ⅱ. Functions of 24C02Ⅲ. Basic operations of 24C02Ⅳ. Application of 24C02Ⅴ. 24C02 pinoutⅥ. How to protect the data of 24C02?Ⅶ. How to use 24C02?EEPROM refers...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.