Texas Instruments DLP4500NIRFQE

DLP4500NIRFQE Overview
The package or case for this particular electronic component is an 80-CLCC, which stands for Ceramic Leaded Chip Carrier. This type of package is commonly used for integrated circuits and has 80 terminations, or connection points. The Moisture Sensitivity Level (MSL) for this component is 1, which means it has an unlimited shelf life and can be stored for an indefinite amount of time. An additional feature of this package is SEATED HGT-CALCULATED, which refers to the calculated height of the component when it is properly seated on a circuit board. The maximum power dissipation for this component is 250mW and it operates at a supply voltage of 2.5V, with a minimum supply voltage of 2.375V. The operating supply current is 125mA and the thickness of the component is 3.3mm. Lastly, this particular component is not radiation hardened, meaning it is not designed to withstand exposure to high levels of radiation.

DLP4500NIRFQE Features
Applications : 3D, Medical Imaging
Operating Supply Current at 125mA

DLP4500NIRFQE Applications
There are a lot of Texas Instruments DLP4500NIRFQE Specialized ICs applications.

Reference Design License Management
Lossless generation of zero crossing signal
Adapters requiring ultra low no-load consumption
Printer Cartridge Identification and Authentication
Membrane Keypads
MP3 Players
PDAs and Palmtop Devices
Ecosystem Control
Secure Management of Limited Use Consumables
Portable Instruments