BGSX210MA18E6327XTSA1

Infineon Technologies BGSX210MA18E6327XTSA1

Part Number:
BGSX210MA18E6327XTSA1
Manufacturer:
Infineon Technologies
Ventron No:
4400148-BGSX210MA18E6327XTSA1
Description:
CMOS SWITCH
ECAD Model:
Datasheet:
BGSX210MA18E6327XTSA1

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Specifications
Infineon Technologies BGSX210MA18E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies BGSX210MA18E6327XTSA1.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    18-UFQFN Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -30°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2005
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    18
  • Technology
    CMOS
  • Voltage - Supply
    2.5V~3.4V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BUTT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.4mm
  • Frequency
    3.8GHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBCC-B18
  • Supply Voltage-Max (Vsup)
    3.4V
  • Supply Voltage-Min (Vsup)
    2.5V
  • Number of Channels
    2
  • Test Frequency
    2.5GHz~2.7GHz
  • Analog IC - Other Type
    CROSS POINT SWITCH
  • Frequency Range
    100MHz~3.8GHz
  • Insertion Loss
    0.65dB
  • Isolation
    39dB
  • RF Type
    LTE
  • Length
    2.4mm
  • Height Seated (Max)
    0.65mm
  • Width
    2mm
  • RoHS Status
    ROHS3 Compliant
Description
BGSX210MA18E6327XTSA1 Overview
Using the Tape & Reel (TR) package, this RF Switch optimizes the performance of the RF Switch 12v.A RF Switch consists of 18 terminations.In order for it to operate properly, RF Switch's operating temperature should be at -30°C~85°C.An RF switch ic with the LTE RF type.RF Switchs that can supply 2.5V~3.4V volts are available.

BGSX210MA18E6327XTSA1 Features
Tape & Reel (TR) package
18 terminations
LTE RF Type


BGSX210MA18E6327XTSA1 Applications
There are a lot of Infineon Technologies
BGSX210MA18E6327XTSA1 RF Switches applications.


Tuner modules
Antenna diversity switching
Cellular/PCS Base Stations
ISM
Wireless Local Loop
Smartphones
Tablets
Mobile devices
Smart metering
Cellular infrastructures
BGSX210MA18E6327XTSA1 More Descriptions
RF Switch DP10T 100MHz to 3.8GHz 16dB 18-Pin ATSLP EP T/R
functionality of two ports; RF CMOS DP10T diversity switch with power handling capability of up to 27 dBm; Device configurations SP5T/SP5T, SP4T/SP6T, and
RF SWITCH, 3.8GHZ, -30 TO 85DEG C; Frequency Min: 100MHz; Frequency Max: 3.8GHz; RF IC Case Style: ATSLP; No. of Pins: 18Pins; Supply Voltage Min: 2.5V; Supply Voltage Max: 3.4V; Operating Temperature Min: -30°C; Operating Temperature Max: 85°C; Product Range: -; Automotive Qualification Standard: -; SVHC: No SVHC (27-Jun-2018)
DP10T Diversity Cross Switch for Carrier Aggregation | Summary of Features: Industrys first flexible carrier aggregation switch via cross switch functionality of two ports; RF CMOS DP10T diversity switch with power handling capability of up to 27 dBm; Device configurations SP5T/SP5T, SP4T/SP6T, and SP6T/SP4T featured via cross switch functionality; Suitable for LTE carrier aggregation applications; Ultra-low insertion loss and harmonics generation; 0.1 to 3.8 GHz coverage; High port-to-port-isolation; No decoupling capacitors required if no DC applied on RF lines; Integrated MIPI RFFE interface operating in 1.1 to 1.95 V voltage range; Software programmable MIPI RFFE USID Leadless and halogen free package ATSLP-18 with lateral size of 2.0mm x 2.4mm and thickness of 0.6mm; No power supply blocking required; High EMI robustness; RoHS and WEEE compliant package | Target Applications: RF CMOS switch is specifically designed for LTE carrier aggregation applications.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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