Microchip Technology 93LC66/P

93LC66/P Overview
The mounting type of this particular component is through hole, meaning that it is designed to be inserted into holes on a circuit board and then soldered in place. Unlike surface mount components, which are attached directly to the surface of the board, this one does not have surface mount capabilities. According to the JESD-609 code, it has been tested and certified to have an e3 level of robustness against electrostatic discharge. Additionally, it has a moisture sensitivity level of not applicable, indicating that it is not at risk for damage from exposure to moisture. The terminal pitch, or distance between the component's terminals, is 2.54mm. This memory component has a size of 4Kb, with either 512 x 8 or 256 x 16 memory organization. It is also non-volatile, meaning that it retains its data even when power is turned off. The maximum write cycle time, or the time it takes for data to be written to the memory, is 10ms. This component has a height of 3.68mm and a length of 9.78mm.

93LC66/P Features
Package / Case: 8-DIP (0.300, 7.62mm)
8 Pins
Operating Supply Voltage:2.5V
Additional Feature:100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS

93LC66/P Applications
There are a lot of Microchip Technology 93LC66/P Memory applications.

DVD disk buffer
personal digital assistants
data buffer
workstations,
telecommunications
networking
eDRAM
graphics card
printers
personal computers