IDT, Integrated Device Technology Inc 89HP0508PZBABI

89HP0508PZBABI Overview
The mounting type for the electronic component is surface mount, meaning it is designed to be placed directly onto a printed circuit board. The specific package or case for this component is a 100-LFBGA, which stands for Low Profile Fine Pitch Ball Grid Array. It is typically used for high-speed and high-density applications. The packaging for this component is in a tray, which is a container used for shipping and storing electronic components. However, this particular component is now considered obsolete, meaning it is no longer in production. It has a moisture sensitivity level (MSL) of 3, which indicates that it can withstand exposure to moisture for up to 168 hours. The base part number for this component is IDT89HP0508, and it is designed to interface with the popular PCI Express technology. Lastly, it is important to note that this component is not compliant with the Restriction of Hazardous Substances (RoHS) directive.

89HP0508PZBABI Features
It is based on IDT89HP0508.

89HP0508PZBABI Applications
There are a lot of Renesas Electronics America Inc. 89HP0508PZBABI Specialized Interface ICs applications.

Remote Powered Equipment
Communication systems
Modems
?Wireless Local Loop, Intelligent PBX, ISDN NT1/TA
Relay replacements
Compatible with 65 V DACs and ADCs such as
Multiplexers
Cable Modem, Cable PC
T1/E1 Terminals
Battery Powered Systems