74LVC2G17GW,125
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Nexperia USA Inc. 74LVC2G17GW,125

Part Number:
74LVC2G17GW,125
Manufacturer:
Nexperia USA Inc.
Ventron No:
3200442-74LVC2G17GW,125
Description:
IC SCHMT TRIG BUFF/DVR DL 6TSSOP
ECAD Model:
Datasheet:
74LVC2G17GW,125
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Part Overview
Description
The 74LVC2G17 is a dual buffer with Schmitt-trigger inputs. It features a wide supply voltage range from 1.65 V to 5.5 V, overvoltage tolerant inputs to 5.5 V, and high noise immunity. The device has a ±24 mA output drive (Vcc ≥ 3.0 V), CMOS low-power consumption, and latch-up performance exceeding 250 mA. It complies with JEDEC standards JESD8-7, JESD8-5, and JESD-8B/JESD36. The 74LVC2G17 is specified for partial power down applications using lOFF circuitry, which disables the output to prevent backflow current.

Features
Wide supply voltage range: 1.65 V to 5.5 V
Overvoltage tolerant inputs: 5.5 V
High noise immunity
±24 mA output drive (Vcc ≥ 3.0 V)
CMOS low-power consumption
Latch-up performance: >250 mA
Direct interface with TTL levels
lOFF circuitry for partial power-down mode
JEDEC compliant: JESD8-7, JESD8-5, JESD-8B/JESD36
ESD protection: HBM >2000 V, CDM >1000 V
Multiple package options
Specified for -40 °C to 85 °C and -40 °C to 125 °C

Applications
Wave and pulse shapers for highly noisy environments
Specifications
Nexperia USA Inc. 74LVC2G17GW,125 technical specifications, attributes, parameters and parts with similar specifications to Nexperia USA Inc. 74LVC2G17GW,125.
  • Factory Lead Time
    4 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    6-TSSOP, SC-88, SOT-363
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    5
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2012
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74LVC
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin (Sn)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.65V~5.5V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    2
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    1.8V
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    74LVC2G17
  • Pin Count
    6
  • JESD-30 Code
    R-PDSO-G6
  • Qualification Status
    Not Qualified
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Push-Pull
  • Number of Elements
    2
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Schmitt Trigger
  • Family
    LVC/LCX/Z
  • Current - Output High, Low
    32mA 32mA
  • Logic Type

    Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.

    Buffer, Non-Inverting
  • Number of Bits per Element

    Number of Bits Per Element (NBE) specifies the number of bits used to represent each element in a digital signal. It determines the resolution and precision of the signal. A higher NBE results in a more accurate representation of the signal, but also increases the data size and processing requirements. NBE is commonly used in digital-to-analog converters (DACs), analog-to-digital converters (ADCs), and other digital signal processing systems.

    1
  • RoHS Status
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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