IDT, Integrated Device Technology Inc 72T18105L5BBI
- Part Number:
- 72T18105L5BBI
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3210232-72T18105L5BBI
- Description:
- IC FIFO 131X18 2.5V 5NS 240BGA
- Datasheet:
- 72T18105L5BBI
IDT, Integrated Device Technology Inc 72T18105L5BBI technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T18105L5BBI.
- Factory Lead Time7 Weeks
- Contact PlatingLead, Tin
- MountSurface Mount
- Package / CaseBGA
- Number of Pins240
- Published2009
- Part StatusActive
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- Operating Supply Voltage2.5V
- Max Supply Voltage2.625V
- Min Supply Voltage2.375V
- Element ConfigurationDual
- Nominal Supply Current70mA
- Max Supply Current70mA
- Frequency (Max)200MHz
- Access Time3.6 ns
- DirectionUnidirectional
- Density2.3 Mb
- Sync/AsyncAsynchronous
- Bus DirectionalUnidirectional
- Retransmit CapabilityYes
- FWFT SupportYes
- Programmable Flags SupportYes
- Length19mm
- Width19mm
- Thickness1.76mm
- RoHS StatusRoHS Compliant
- Lead FreeContains Lead
72T18105L5BBI Overview
This component is manufactured by IDT, also known as Integrated Device Technology Inc. It is a type of Logic - FIFOs Memory chip, which falls under the Logic - FIFOs Memory category. The contact plating used for this chip is a combination of lead and tin. It was first published in 2009 and is currently still in active production. It operates with a supply voltage of 2.5V and has a nominal supply current of 70mA. This chip can be used in both synchronous and asynchronous modes. It also has the capability to retransmit data and supports First Word Fall Through (FWFT). Additionally, it has programmable flags that can be customized for specific functions. The chip itself is 19mm in length.
72T18105L5BBI Features
Frequency at most
72T18105L5BBI Applications
There are a lot of Integrated Device Technology (IDT) 72T18105L5BBI FIFOs Memory applications.
Telecommunication
Portable Information Devices
Video
Thermal Management for DDR3 Memory Modules
MP3 Interface for Automobile
Desktop Computers
GPS Offender Tracking
Measurement Equipment
Fabrication Site
Communications
This component is manufactured by IDT, also known as Integrated Device Technology Inc. It is a type of Logic - FIFOs Memory chip, which falls under the Logic - FIFOs Memory category. The contact plating used for this chip is a combination of lead and tin. It was first published in 2009 and is currently still in active production. It operates with a supply voltage of 2.5V and has a nominal supply current of 70mA. This chip can be used in both synchronous and asynchronous modes. It also has the capability to retransmit data and supports First Word Fall Through (FWFT). Additionally, it has programmable flags that can be customized for specific functions. The chip itself is 19mm in length.
72T18105L5BBI Features
Frequency at most
72T18105L5BBI Applications
There are a lot of Integrated Device Technology (IDT) 72T18105L5BBI FIFOs Memory applications.
Telecommunication
Portable Information Devices
Video
Thermal Management for DDR3 Memory Modules
MP3 Interface for Automobile
Desktop Computers
GPS Offender Tracking
Measurement Equipment
Fabrication Site
Communications
72T18105L5BBI More Descriptions
FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 128K x 18/256K x 9 240-Pin BGA
PBGA-240(19x19) FIFO Memory ROHS
128K x 18 / 256K x 9 TeraSync FIFO, 2.5V
IC FIFO ASYNC/SYN 256KX9 240BGA
IC FIFO 131X18 2.5V 5NS 240BGA
FIFO 128K18/256X9 TERASYNC 2.5V
PBGA-240(19x19) FIFO Memory ROHS
128K x 18 / 256K x 9 TeraSync FIFO, 2.5V
IC FIFO ASYNC/SYN 256KX9 240BGA
IC FIFO 131X18 2.5V 5NS 240BGA
FIFO 128K18/256X9 TERASYNC 2.5V
The three parts on the right have similar specifications to 72T18105L5BBI.
-
ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseNumber of PinsPublishedPart StatusMax Operating TemperatureMin Operating TemperatureOperating Supply VoltageMax Supply VoltageMin Supply VoltageElement ConfigurationNominal Supply CurrentMax Supply CurrentFrequency (Max)Access TimeDirectionDensitySync/AsyncBus DirectionalRetransmit CapabilityFWFT SupportProgrammable Flags SupportLengthWidthThicknessRoHS StatusLead FreeMounting TypeOperating TemperaturePackagingSeriesMoisture Sensitivity Level (MSL)Voltage - SupplyBase Part NumberFunctionCurrent - Supply (Max)Memory SizeData RateExpansion TypeJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountQualification StatusTemperature GradeClock FrequencyOrganizationStandby Current-MaxParallel/SerialMemory IC TypeOutput EnableCycle TimeHeight Seated (Max)View Compare
-
72T18105L5BBI7 WeeksLead, TinSurface MountBGA2402009Active85°C-40°C2.5V2.625V2.375VDual70mA70mA200MHz3.6 nsUnidirectional2.3 MbAsynchronousUnidirectionalYesYesYes19mm19mm1.76mmRoHS CompliantContains Lead---------------------------------------
-
12 Weeks--240-BGA--Active---------8ns, 3.4ns---Uni-Directional-Yes----Non-RoHS Compliant-Surface Mount0°C~70°CTray72T3 (168 Hours)2.375V~2.625V72T18125Asynchronous, Synchronous70mA9M 512K x 18 1M x 9100MHz, 225MHzDepth, Width--------------------------
-
7 WeeksLead, TinSurface MountBGA2402009Active70°C0°C2.5V2.625V2.375VDual70mA70mA200MHz3.6 ns-4.5 MbAsynchronousUnidirectionalYes--19mm19mm1.76mmRoHS CompliantContains Lead--Bulk-3-------e0no240EAR99Tin/Lead (Sn63Pb37)8542.32.00.71FIFOsCMOSBOTTOMBALL22512.5V1mm20240Not QualifiedCOMMERCIAL83MHz256KX180.02APARALLELOTHER FIFOYES5 ns1.97mm
-
12 Weeks--240-BGA--Active---------12ns, 3.8ns---Uni-Directional-Yes----Non-RoHS Compliant-Surface Mount0°C~70°CTray72T3 (168 Hours)2.375V~2.625V72T18115Asynchronous, Synchronous70mA4.5M 256K x 18 512K x 966MHz, 150MHzDepth, Width--------------------------
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