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IDT, Integrated Device Technology Inc 70V9159L7PFI

Name: 70V9159L7PFI
Brand: IDT, Integrated Device Technology Inc
SKU: 3724242-70V9159L7PFI
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 70V9159L7PFI

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3724242-70V9159L7PFI

Description:: IC SRAM 72KBIT 7.5NS 100TQFP

ECAD Model:

Datasheet:: IDT Suffixes

Payment:

Delivery:

Part Overview

Description
The IDT70V9169/59L is a high-speed, synchronous, pipelined, dual-port static RAM with a capacity of 16/8K x 9 bits. It features true dual-ported memory cells that allow simultaneous access to the same memory location. The device operates from a single 3.3V (±0.3V) power supply and is available in a 100-pin Thin Quad Flatpack (TQFP) and 100-pin fine pitch Ball Grid Array (fpBGA) packages.

Features
True dual-ported memory cells
High-speed clock to data access:
Commercial: 6.5/7.5/9ns (max.)
Industrial: 7.5ns (max.)
Low-power operation:
Active: 450mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either port
Counter enable and reset features
Dual chip enables for depth expansion without additional logic
Full synchronous operation on both ports
3.5ns setup to clock and 0ns hold on all control, data, and address inputs
Data input, address, and control registers
Fast 6.5ns clock to data out in the Pipelined output mode
Self-timed write allows fast cycle time
10ns cycle time, 100MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for multiplexed bus and bus matching compatibility
LVTTL-compatible
Industrial temperature range (-40°C to 85°C) available for 83 MHz

Applications
High-speed buffering
Cache memory
Tag memory
FIFO memory
Packet buffering
Network switching
Telecom applications

Specifications

IDT, Integrated Device Technology Inc 70V9159L7PFI technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 70V9159L7PFI.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
100-LQFP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tray
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Dual Port, Synchronous
Voltage - Supply
3V~3.6V
Base Part Number
IDT70V9159
Memory Size
72Kb 8K x 9
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
7.5ns
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
RoHS Status
Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to 70V9159L7PFI.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Technology

Voltage - Supply

Base Part Number

Memory Size

Memory Type

Access Time

Memory Format

Memory Interface

RoHS Status

Factory Lead Time

Supplier Device Package

View Compare
70V9159L7PFI

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

-40°C~85°C TA

Tray

Obsolete

3 (168 Hours)

SRAM - Dual Port, Synchronous

3V~3.6V

IDT70V9159

72Kb 8K x 9

Volatile

7.5ns

SRAM

Parallel

Non-RoHS Compliant

-

-

-
70V9099L9PFG

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

0°C~70°C TA

Tray

Active

3 (168 Hours)

SRAM - Dual Port, Synchronous

3V~3.6V

IDT70V9099

1Mb 128K x 8

Volatile

9ns

SRAM

Parallel

ROHS3 Compliant

13 Weeks

100-TQFP (14x14)

70V9159L7PFI vs 70V9099L9PFG
70V9099L9PF

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

0°C~70°C TA

Tray

Obsolete

3 (168 Hours)

SRAM - Dual Port, Synchronous

3V~3.6V

IDT70V9099

1Mb 128K x 8

Volatile

9ns

SRAM

Parallel

Non-RoHS Compliant

-

-

70V9159L7PFI vs 70V9099L9PF
70V9099L7PF8

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

0°C~70°C TA

Tape & Reel (TR)

Obsolete

3 (168 Hours)

SRAM - Dual Port, Synchronous

3V~3.6V

IDT70V9099

1Mb 128K x 8

Volatile

7.5ns

SRAM

Parallel

Non-RoHS Compliant

-

-

70V9159L7PFI vs 70V9099L7PF8