IDT, Integrated Device Technology Inc 7007L20G

7007L20G Overview
The package or case of this particular electronic component is a 68-BPGA, which stands for Ball Grid Array. This type of package is commonly used for integrated circuits, providing a large number of pins for connections. The operating temperature for this component is 0°C to 70°C, making it suitable for a wide range of environments. The packaging for this component is in a tray, which is a type of container used for shipping and storing electronic components. It has a Moisture Sensitivity Level (MSL) of 1, which means that it can be exposed to unlimited moisture without any negative effects. The technology used for this component is SRAM - Dual Port, Asynchronous, which is a type of memory that allows for two independent accesses to the memory at the same time. The voltage supply for this component is 4.5V to 5.5V, which is the range of voltage that the component requires to function properly. The memory size for this component is 256Kb or 32K x 8, meaning it can store 256 kilobits of data in a configuration of 32 kilobytes by 8 bits. The memory format is SRAM, which stands for Static Random Access Memory, a type of memory that retains data as long as power is supplied to it. The memory interface for this component is parallel, meaning that data is transferred in parallel, or simultaneously, through multiple lines. The write cycle time for this component is 20 nanoseconds, which is the time it takes for data to be written to the memory. This component is a high-performance, versatile memory solution suitable for a variety of applications.

7007L20G Features
Package / Case: 68-BPGA


7007L20G Applications
There are a lot of Renesas Electronics America Inc.
7007L20G Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer