5P90011PGGI8

IDT, Integrated Device Technology Inc 5P90011PGGI8

Part Number:
5P90011PGGI8
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
2974732-5P90011PGGI8
Description:
IC CLOCK BUFFER MUX 1:4 24-TSSOP
ECAD Model:
Datasheet:
5P90011PGGI8

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Specifications
IDT, Integrated Device Technology Inc 5P90011PGGI8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 5P90011PGGI8.
  • Factory Lead Time
    4 Weeks
  • Package / Case
    TSSOP
  • Published
    2006
  • RoHS Status
    RoHS Compliant
Description
5P90011PGGI8 Overview
The TSSOP package, which stands for Thin Shrink Small Outline Package, was first published in 2006. This package is a type of surface mount integrated circuit (IC) package that is widely used in the electronics industry. It is known for its small size and low profile, making it ideal for compact and portable devices. Additionally, the TSSOP package is also known for its high reliability and low cost. Furthermore, it is important to note that this package is RoHS compliant, meaning that it adheres to the Restriction of Hazardous Substances directive, making it environmentally friendly. Overall, the TSSOP package has become a popular choice for many electronic manufacturers due to its compact size, reliability, and compliance with RoHS standards.

5P90011PGGI8 Features

5P90011PGGI8 Applications
There are a lot of Integrated Device Technology (IDT) 5P90011PGGI8 Clock Buffers & Drivers applications.

Dual core processor workstations and servers
Data communication
High speed industry
High speed line receiver
Aviation
Network
Industrial automation control system
Threshold detection
Cell Phone (UMTS/WCDMA/GSM)
Fibre channel (FC)
5P90011PGGI8 More Descriptions
Clock Generators & Support Products REAL TIME CLOCK
IC CLOCK BUFFER MUX 1:4 24-TSSOP
20 TSSOP (GREEN)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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