Part Number: XCZU2EG-L1SFVA625I vs XCZU7EV-1FBVB900E

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Part Number: XCZU2EG-L1SFVA625I XCZU7EV-1FBVB900E
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC FPGA 180 I/O 625FCBGA IC FPGA 204 I/O 900FCBGA
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 11 Weeks 11 Weeks
Package / Case 625-BFBGA, FCBGA 900-BBGA, FCBGA
Surface Mount YES -
Operating Temperature -40°C~100°C TJ 0°C~100°C TJ
Packaging Tray Tray
Series Zynq® UltraScale ™ MPSoC EG Zynq® UltraScale ™ MPSoC EV
Part Status Active Active
Moisture Sensitivity Level (MSL) 4 (72 Hours) 4 (72 Hours)
Number of Terminations 625 -
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY -
HTS Code 8542.31.00.01 8542.31.00.01
Technology CMOS -
Terminal Position BOTTOM -
Terminal Form BALL -
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Supply Voltage 0.72V -
Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
JESD-30 Code R-PBGA-B625 -
Supply Voltage-Max (Vsup) 0.742V -
Supply Voltage-Min (Vsup) 0.698V -
Number of I/O 180 204
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz
RAM Size 256KB 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA
Primary Attributes Zynq®UltraScale ™ FPGA, 103K Logic Cells Zynq®UltraScale ™ FPGA, 504K Logic Cells
RoHS Status ROHS3 Compliant ROHS3 Compliant
Published - 2016
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