| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
XCZU19EG-1FFVC1760E |
XCZU7CG-2FFVC1156E |
| Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
| Description: |
IC FPGA 512 I/O 1760FCBGA |
IC FPGA 360 I/O 1156FCBGA |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
|
-
|
| Factory Lead Time |
11 Weeks |
11 Weeks |
| Package / Case |
1760-BBGA, FCBGA |
1156-BBGA, FCBGA |
| Operating Temperature |
0°C~100°C TJ |
0°C~100°C TJ |
| Packaging |
Tray |
Tray |
| Published |
2016 |
2016 |
| Series |
Zynq® UltraScale ™ MPSoC EG |
Zynq® UltraScale ™ MPSoC CG |
| Part Status |
Active |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
4 (72 Hours) |
| HTS Code |
8542.31.00.01 |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
NOT SPECIFIED |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
NOT SPECIFIED |
| Number of I/O |
512 |
360 |
| Speed |
500MHz, 600MHz, 1.2GHz |
533MHz, 1.3GHz |
| RAM Size |
256KB |
256KB |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals |
DMA, WDT |
DMA, WDT |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
MCU, FPGA |
| Primary Attributes |
Zynq®UltraScale ™ FPGA, 1143K Logic Cells |
Zynq®UltraScale ™ FPGA, 504K Logic Cells |
| RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
| Pbfree Code |
- |
yes |
| Submit RFQ: |
Submit |
Submit |
