| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
XC7Z045-2FF900E |
XC7Z045-2FFG676E |
| Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
| Description: |
IC SOC CORTEX-A9 KINTEX7 900BGA |
IC SOC CORTEX-A9 KINTEX7 676FBGA |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
|
-
|
| Factory Lead Time |
10 Weeks |
10 Weeks |
| Package / Case |
900-BBGA, FCBGA |
676-BBGA, FCBGA |
| Surface Mount |
YES |
YES |
| Operating Temperature |
0°C~100°C TJ |
0°C~100°C TJ |
| Packaging |
Tray |
Tray |
| Published |
2010 |
2009 |
| Series |
Zynq®-7000 |
Zynq®-7000 |
| Pbfree Code |
no |
- |
| Part Status |
Active |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
4 (72 Hours) |
| Number of Terminations |
900 |
676 |
| Additional Feature |
GPIO WITH FOUR 32-BIT BANKS |
- |
| HTS Code |
8542.39.00.01 |
8542.39.00.01 |
| Technology |
CMOS |
CMOS |
| Terminal Position |
BOTTOM |
BOTTOM |
| Terminal Form |
BALL |
BALL |
| Frequency |
800MHz |
800MHz |
| JESD-30 Code |
S-PBGA-B900 |
S-PBGA-B676 |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
130 |
| RAM Size |
256KB |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
MCU, FPGA |
| Core Architecture |
ARM |
ARM |
| Boundary Scan |
YES |
YES |
| RAM (words) |
256000 |
256000 |
| Primary Attributes |
Kintex™-7 FPGA, 350K Logic Cells |
Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility |
CAN, ETHERNET, I2C, PCI, SPI, UART, USB |
CAN; ETHERNET; I2C; SPI; UART; USB |
| RoHS Status |
Non-RoHS Compliant |
ROHS3 Compliant |
| Contact Plating |
- |
Copper, Silver, Tin |
| JESD-609 Code |
- |
e1 |
| ECCN Code |
- |
3A991.D |
| Terminal Finish |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Peak Reflow Temperature (Cel) |
- |
245 |
| Supply Voltage |
- |
1V |
| Terminal Pitch |
- |
1mm |
| Reflow Temperature-Max (s) |
- |
30 |
| Base Part Number |
- |
XC7Z045 |
| Operating Supply Voltage |
- |
1V |
| Supply Voltage-Max (Vsup) |
- |
1.05V |
| Memory Type |
- |
ROMless |
| Data Bus Width |
- |
32b |
| Speed Grade |
- |
-2 |
| Height Seated (Max) |
- |
3.37mm |
| Length |
- |
27mm |
| Radiation Hardening |
- |
No |
| Submit RFQ: |
Submit |
Submit |
