Part Number: XCZU9CG-2FFVC900I vs XCZU7EV-1FBVB900E
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| Part Number: | XCZU9CG-2FFVC900I | XCZU7EV-1FBVB900E |
| Manufacturer: | Xilinx Inc. | Xilinx Inc. |
| Description: | IC FPGA 204 I/O 900FCBGA | IC FPGA 204 I/O 900FCBGA |
| Quantity Available: | Available | Available |
| Datasheets: | - | - |
| Factory Lead Time | 11 Weeks | 11 Weeks |
| Package / Case | 900-BBGA, FCBGA | 900-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ | 0°C~100°C TJ |
| Packaging | Tray | Tray |
| Series | Zynq® UltraScale ™ MPSoC CG | Zynq® UltraScale ™ MPSoC EV |
| Part Status | Active | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | 4 (72 Hours) |
| Number of I/O | 204 | 204 |
| Speed | 533MHz, 1.3GHz | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale ™ FPGA, 599K Logic Cells | Zynq®UltraScale ™ FPGA, 504K Logic Cells |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Published | - | 2016 |
| HTS Code | - | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | - | NOT SPECIFIED |
| Reflow Temperature-Max (s) | - | NOT SPECIFIED |
| Submit RFQ: | Submit | Submit |
| Image | Part Number | Manufacturer | Description | Compare |
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XCZU7EV-L2FFVF1517E | Xilinx Inc. | IC FPGA 464 I/O 1517FCBGA | Compare |
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XCZU7EG-L1FFVC1156I | Xilinx Inc. | IC FPGA 360 I/O 1156FCBGA | Compare |
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XCZU7EV-2FBVB900I | Xilinx Inc. | IC FPGA 204 I/O 900FCBGA | Compare |
