Xilinx Inc. XCZU9CG-2FFVC900I
- Part Number:
- XCZU9CG-2FFVC900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162357-XCZU9CG-2FFVC900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU9CG-2FFVC900I
Xilinx Inc. XCZU9CG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9CG-2FFVC900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of I/O204
- Speed533MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 599K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The manufacturer of this component is Xilinx Inc. It is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. The package or case type is 900-BBGA, FCBGA, and it can operate within a temperature range of -40°C to 100°C TJ. This specific model belongs to the Zynq® UltraScale ™ MPSoC CG series and is currently in an active production status. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has a total of 204 input/output connections and a RAM size of 256KB. The core processor is a Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a Dual ARM®Cortex™-R5 with CoreSight™. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip is designed with a combination of a microcontroller unit (MCU) and a field-programmable gate array (FPGA), making it suitable for a wide range of applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9CG-2FFVC900I System On Chip (SoC) applications.
Industrial automation devices
Mobile computing
Temperature Sensors
Apple smart watch
Medical Pressure
Efficient hardware for training of neural networks
Three phase UPS
Networked sensors
ARM processors
Mobile market
The manufacturer of this component is Xilinx Inc. It is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. The package or case type is 900-BBGA, FCBGA, and it can operate within a temperature range of -40°C to 100°C TJ. This specific model belongs to the Zynq® UltraScale ™ MPSoC CG series and is currently in an active production status. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has a total of 204 input/output connections and a RAM size of 256KB. The core processor is a Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a Dual ARM®Cortex™-R5 with CoreSight™. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip is designed with a combination of a microcontroller unit (MCU) and a field-programmable gate array (FPGA), making it suitable for a wide range of applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9CG-2FFVC900I System On Chip (SoC) applications.
Industrial automation devices
Mobile computing
Temperature Sensors
Apple smart watch
Medical Pressure
Efficient hardware for training of neural networks
Three phase UPS
Networked sensors
ARM processors
Mobile market
XCZU9CG-2FFVC900I More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 600K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 600K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU9CG-2FFVC900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypePublishedView Compare
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XCZU9CG-2FFVC900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTrayZynq® UltraScale ™ MPSoC CGActive4 (72 Hours)204533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant----------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTrayZynq® UltraScale ™ MPSoC EGActive4 (72 Hours)180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT-
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTrayZynq® UltraScale ™ MPSoC EVActive4 (72 Hours)204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant---8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED----2016
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTrayZynq® UltraScale ™ MPSoC EVActive4 (72 Hours)464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant---8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED----2016
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