XCZU9CG-2FFVC900I

Xilinx Inc. XCZU9CG-2FFVC900I

Part Number:
XCZU9CG-2FFVC900I
Manufacturer:
Xilinx Inc.
Ventron No:
3162357-XCZU9CG-2FFVC900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU9CG-2FFVC900I

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Specifications
Xilinx Inc. XCZU9CG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9CG-2FFVC900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of I/O
    204
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The manufacturer of this component is Xilinx Inc. It is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. The package or case type is 900-BBGA, FCBGA, and it can operate within a temperature range of -40°C to 100°C TJ. This specific model belongs to the Zynq® UltraScale ™ MPSoC CG series and is currently in an active production status. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has a total of 204 input/output connections and a RAM size of 256KB. The core processor is a Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a Dual ARM®Cortex™-R5 with CoreSight™. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip is designed with a combination of a microcontroller unit (MCU) and a field-programmable gate array (FPGA), making it suitable for a wide range of applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU9CG-2FFVC900I System On Chip (SoC) applications.

Industrial automation devices
Mobile computing
Temperature Sensors
Apple smart watch
Medical Pressure
Efficient hardware for training of neural networks
Three phase UPS
Networked sensors
ARM processors
Mobile market
XCZU9CG-2FFVC900I More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 600K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU9CG-2FFVC900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    Published
    View Compare
  • XCZU9CG-2FFVC900I
    XCZU9CG-2FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    204
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
    -
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    -
    2016
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    -
    2016
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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