0 Shopping Cart

NXP USA Inc. MC9S08GT32ACBE

Numéro de pièce:

MC9S08GT32ACBE

Fabricant:

NXP USA Inc.

Ventron N°:

3157323-MC9S08GT32ACBE

Description:

IC MCU 8BIT 32KB FLASH 42PSDIP

Fiche de données:

MC9S08GT32ACBE

Quantité:

- +
Total Price: $5.52

Paiement:

Payment

Livraison:

Delivery

Demande de devis rapide

Prix de référence (en dollars américains)

Tarifs

Quantité

Prix unitaire

Prix ext.

  • 1

    $5.5208

    $5.52

  • 200

    $2.1371

    $427.42

  • 500

    $2.0615

    $1030.75

  • 1000

    $2.0244

    $2024.40

Vous souhaitez un prix de gros plus bas ? Envoyez-nous une demande et nous vous répondrons immédiatement.
Quantité
Comments
  • One Stop Service

    Service à guichet unique

  • Competitive Price

    prix compétitif

  • Source Traceability

    Traçabilité de la source

  • Same Day Delivery

    Livraison le jour même

Caractéristiques

NXP USA Inc. MC9S08GT32ACBE spécifications techniques, attributs, paramètres et pièces ayant des spécifications similaires à NXP USA Inc. MC9S08GT32ACBE.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    42-SDIP (0.600, 15.24mm)
  • Supplier Device Package
    42-PDIP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    S08
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Oscillator Type
    Internal
  • Number of I/O
    33
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    40MHz
  • RAM Size
    2K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.8V~3.6V
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    S08
  • Peripherals
    LVD, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    8-Bit
  • Program Memory Size
    32KB 32K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    I2C, SCI, SPI
  • Data Converter
    A/D 8x10b
  • RoHS Status
    ROHS3 Compliant

Description

MC9S08GT32ACBE Overview
The package is 42-SDIP (0.600, 15.24mm)-shaped. There are 33 I/Os. In the case of the IC chip, the type of mounting is Through Hole. Microcontroller is based on the 8-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the S08 series of electrical components. Having a size of 32KB 32K x 8, Microcontroller has a program memory of X bytes. A S08 Core Processor is at the core of this Microcontroller.

MC9S08GT32ACBE Features
42-SDIP (0.600, 15.24mm) package
Mounting type of Through Hole


MC9S08GT32ACBE Applications
There are a lot of Rochester Electronics, LLC
MC9S08GT32ACBE Microcontroller applications.


Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
MC9S08GT32ACBE More Descriptions
ROHS3Compliant Through Hole FLASH Internal Microcontroller -40C~85C TA 40MHz 2K x 8 1.8V~3.6V
S08 S08 Microcontroller IC 8-Bit 40MHz 32KB (32K x 8) FLASH 42-PSDIP
MCU 8-bit HCS08 CISC 32KB Flash 2.5V/3.3V 42-Pin SPDIP Rail
MCU, 8BIT, S08, 40MHZ, NDIP-42; Product Range:S08 Family S08GT Series Microcontrollers; CPU Speed:40MHz; Program Memory Size:32KB; RAM
MCU, 8BIT, S08, 40MHZ, NDIP-42; Product Range: S08 Family S08GT Series Microcontrollers; CPU Speed: 40MHz; Program Memory Size: 32KB; RAM Memory Size: 2KB; No. of Pins: 42Pins; MCU Case Style: NDIP; No. of I/O's: 34I/O's; Embedded Interface Type: I2C, SCI, SPI; Supply Voltage Min: 1.8V; Supply Voltage Max: 3.6V; MCU Family: S08; MCU Series: S08GT; Automotive Qualification Standard: -; RoHS Phthalates Compliant: Yes; MSL: -; SVHC: No SVHC (27-Jun-2018); Clock Frequency: 20MHz; Controller Family/Series: HCS08; Flash Memory Size: 32KB; MPU Core Size: 8bit; No. of ADC Inputs: 8; No. of PWM Channels: 8; No. of Timers: 2; Number of bits in ADC: 10; Operating Temperature Max: 85°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to 85°C; Oscillator Type: External, Internal; Peripherals: ADC, PWM, Timer; Program Memory Size: 32KB; Supply Voltage Range: 1.8V to 3.6V; Termination Type: Through Hole

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Dernières nouvelles