3G Shielding Specialties LP WS-3335-KC-2400
- Part Number:
- WS-3335-KC-2400
- Manufacturer:
- 3G Shielding Specialties LP
- Ventron No:
- 8849569-WS-3335-KC-2400
- Description:
- Fabric Over Foam 0.375 9.53mm 24.000 609.60mm 0.375 9.53mm Polyurethane Foam, Nickel-Copper Polyester (NI/CU) C-Fold -40°C~71°C
- Datasheet:
- WS-3335-KC-2400
3G Shielding Specialties LP WS-3335-KC-2400 technical specifications, attributes, parameters and parts with similar specifications to 3G Shielding Specialties LP WS-3335-KC-2400.
- MaterialPolyurethane Foam, Nickel-Copper Polyester (NI/CU)
- ShapeC-Fold
- Operating Temperature-40°C~71°C
- Part StatusActive
- Moisture Sensitivity Level (MSL)Not Applicable
- Attachment MethodAdhesive
- Height0.375 9.53mm
- Length24.000 609.60mm
- Width0.375 9.53mm
- RoHS StatusROHS3 Compliant
WS-3335-KC-2400 Overview
The Contact RFI contains materials from Polyurethane Foam, Nickel-Copper Polyester (NI/CU).-40°C~71°C is the operating temperature of the EMI/RFI.Fabric Over Foam RF Type from the contacter RFI.
WS-3335-KC-2400 Features
Fabric Over Foam
WS-3335-KC-2400 Applications
There are a lot of 3G Shielding Specialties LP
WS-3335-KC-2400 RFI and EMI Contacts applications.
Receive
Switch
LoT applications
Power Amplifier
Low Noise Amplifier
Power management
Internet of Things
Secure Payment
Home and Security
Health and Fitness
The Contact RFI contains materials from Polyurethane Foam, Nickel-Copper Polyester (NI/CU).-40°C~71°C is the operating temperature of the EMI/RFI.Fabric Over Foam RF Type from the contacter RFI.
WS-3335-KC-2400 Features
Fabric Over Foam
WS-3335-KC-2400 Applications
There are a lot of 3G Shielding Specialties LP
WS-3335-KC-2400 RFI and EMI Contacts applications.
Receive
Switch
LoT applications
Power Amplifier
Low Noise Amplifier
Power management
Internet of Things
Secure Payment
Home and Security
Health and Fitness
WS-3335-KC-2400 More Descriptions
FAB/FOAM GASKET .375WX.375HX24L
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
18 September 2023
TL074CN Symbol, Features and Package
Ⅰ. Overview of TL074CNⅡ. 3D Model and symbol of TL074CNⅢ. Footprint of TL074CNⅣ. Technical parametersⅤ. Features of TL074CNⅥ. Application of TL074CNⅦ. Package of TL074CNⅧ. How to optimize the... -
18 September 2023
STM32F103C6T6 Microcontroller:Features, Package and Application
Ⅰ. What is STM32F103C6T6?Ⅱ. 3D Model and pins of STM32F103C6T6Ⅲ. Technical parametersⅣ. Features of STM32F103C6T6Ⅴ. Package of STM32F103C6T6Ⅵ. Application of STM32F103C6T6Ⅶ. Components of the STM32F103C6T6 minimum system boardⅧ.... -
19 September 2023
Comparison Between 2N3055 vs TIP3055
Ⅰ. Overview of 2N3055Ⅱ. Overview of TIP3055Ⅲ. Pin diagram comparisonⅣ. Technical parametersⅤ. Comparison of current amplification factorsⅥ. Package comparisonⅦ. Symbol of 2N3055 and TIP3055Ⅷ. Application scenarios comparisonⅨ. Can... -
19 September 2023
STM32F303CCT6 Microcontroller: Footprint, Equivalent and Advantages
Ⅰ. What is STM32F303CCT6?Ⅱ. 3D Model and footprint of STM32F303CCT6Ⅲ. Technical parametersⅣ. Features of STM32F303CCT6Ⅴ. Package and packaging of STM32F303CCT6Ⅵ. Typical and maximum current consumptionⅦ. Advantages of STM32F303CCT6...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.