Winbond Electronics W631GG6MB-12
- Part Number:
- W631GG6MB-12
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 7013304-W631GG6MB-12
- Description:
- Memory IC 13mm mm
- Datasheet:
- W631GG6MB-12
Winbond Electronics W631GG6MB-12 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W631GG6MB-12.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case96-VFBGA
- Surface MountYES
- Operating Temperature0°C~95°C TC
- PackagingTray
- Published2017
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations96
- Additional FeatureAUTO/SELF REFRESH
- TechnologySDRAM - DDR3
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage1.5V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B96
- Supply Voltage-Max (Vsup)1.575V
- Supply Voltage-Min (Vsup)1.425V
- Memory Size1Gb 64M x 16
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency800MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization64MX16
- Memory Width16
- Memory Density1073741824 bit
- Height Seated (Max)1mm
- Length13mm
- Width7.5mm
- RoHS StatusROHS3 Compliant
W631GG6MB-12 Overview
The Winbond Electronics Winbond Electronics Memory electronic component is a high-quality memory solution for your design needs. This part is available in a surface mount style and operates efficiently within a temperature range of 0°C to 95°C TC. It comes in a tray packaging and has a supply voltage of 1.5V. Please note that the maximum time at peak reflow temperature is not specified. The JESD-30 code for this product is R-PBGA-B96. The memory size is 1Gb 64M x 16, with a parallel interface and a width of 7.5mm. Additionally, it is important to mention that this product is ROHS3 compliant.
W631GG6MB-12 Features
Package / Case: 96-VFBGA
Additional Feature:AUTO/SELF REFRESH
W631GG6MB-12 Applications
There are a lot of Winbond Electronics
W631GG6MB-12 Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
The Winbond Electronics Winbond Electronics Memory electronic component is a high-quality memory solution for your design needs. This part is available in a surface mount style and operates efficiently within a temperature range of 0°C to 95°C TC. It comes in a tray packaging and has a supply voltage of 1.5V. Please note that the maximum time at peak reflow temperature is not specified. The JESD-30 code for this product is R-PBGA-B96. The memory size is 1Gb 64M x 16, with a parallel interface and a width of 7.5mm. Additionally, it is important to mention that this product is ROHS3 compliant.
W631GG6MB-12 Features
Package / Case: 96-VFBGA
Additional Feature:AUTO/SELF REFRESH
W631GG6MB-12 Applications
There are a lot of Winbond Electronics
W631GG6MB-12 Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
W631GG6MB-12 More Descriptions
R-PBGA-B96 Surface Mount Tray 64MX16 ic memory 800MHz 20ns 7.5mm 1073741824bit
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V Automotive 96-Pin VFBGA
DDR3L 1Gb, 128Mbx16, 1.5V, 1600, VBGA96 Ball (9x13mm2)
Product Description Demo for Development.
IC DRAM 1GBIT PARALLEL 96VFBGA
8M x 8 BANKS x 16 BIT DDR3 SDRAM
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V Automotive 96-Pin VFBGA
DDR3L 1Gb, 128Mbx16, 1.5V, 1600, VBGA96 Ball (9x13mm2)
Product Description Demo for Development.
IC DRAM 1GBIT PARALLEL 96VFBGA
8M x 8 BANKS x 16 BIT DDR3 SDRAM
The three parts on the right have similar specifications to W631GG6MB-12.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthRoHS StatusView Compare
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W631GG6MB-1210 WeeksSurface Mount96-VFBGAYES0°C~95°C TCTray2017Active3 (168 Hours)96AUTO/SELF REFRESHSDRAM - DDR31.425V~1.575VBOTTOMNOT SPECIFIED11.5V0.8mmNOT SPECIFIEDR-PBGA-B961.575V1.425V1Gb 64M x 161VolatileSYNCHRONOUS800MHz20nsDRAMParallel64MX16161073741824 bit1mm13mm7.5mmROHS3 Compliant-
-
10 WeeksSurface Mount78-VFBGA--40°C~95°C TCTape & Reel (TR)2017Active3 (168 Hours)--SDRAM - DDR31.425V~1.575V---------1Gb 128M x 8-Volatile-667MHz20nsDRAMParallel------ROHS3 Compliant
-
10 WeeksSurface Mount78-VFBGA--40°C~95°C TCTape & Reel (TR)2017Active3 (168 Hours)--SDRAM - DDR3L1.283V~1.45V---------1Gb 128M x 8-Volatile-667MHz20nsDRAMParallel------ROHS3 Compliant
-
10 WeeksSurface Mount78-VFBGA--40°C~95°C TCTape & Reel (TR)-Active3 (168 Hours)--SDRAM - DDR3L1.283V~1.45V---------1Gb 128M x 8-Volatile-933MHz20nsDRAMParallel------ROHS3 Compliant
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