Winbond Electronics W25Q512JVBIM
- Part Number:
- W25Q512JVBIM
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 7013604-W25Q512JVBIM
- Description:
- SpiFlash® Memory IC SpiFlash® Series 8mm mm
- Datasheet:
- Prod. Selection Guide
Winbond Electronics W25Q512JVBIM technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q512JVBIM.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case24-TBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesSpiFlash®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations24
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Reach Compliance Codecompliant
- JESD-30 CodeR-PBGA-B24
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size512Mb 64M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O
- Organization64MX8
- Memory Width8
- Memory Density536870912 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Alternate Memory Width1
- Height Seated (Max)1.2mm
- Length8mm
- Width6mm
- RoHS StatusRoHS Compliant
W25Q512JVBIM Overview
This product was manufactured by Winbond Electronics, is an essential Memory electronic component. The package/case dimensions are 24-TBGA, ensuring ample storage space. The operating temperature range for this product is between -40°C to 85°C with a TA rating. The product comes in a tray packaging, making it suitable for various applications. The series of this product is SpiFlash®. It is currently in an active part status. The number of terminations on this product is 24, making it versatile for different connectivity needs. The maximum supply voltage (Vsup) stands at 3.6V, providing optimal performance. The alternate memory width is 1, ensuring efficient data transfer. The height seated (max) is 1.2mm, guaranteeing precise alignment. Lastly, the product's width measures 6mm, adding to its overall dimensions.
W25Q512JVBIM Features
Package / Case: 24-TBGA
W25Q512JVBIM Applications
There are a lot of Winbond Electronics
W25Q512JVBIM Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
This product was manufactured by Winbond Electronics, is an essential Memory electronic component. The package/case dimensions are 24-TBGA, ensuring ample storage space. The operating temperature range for this product is between -40°C to 85°C with a TA rating. The product comes in a tray packaging, making it suitable for various applications. The series of this product is SpiFlash®. It is currently in an active part status. The number of terminations on this product is 24, making it versatile for different connectivity needs. The maximum supply voltage (Vsup) stands at 3.6V, providing optimal performance. The alternate memory width is 1, ensuring efficient data transfer. The height seated (max) is 1.2mm, guaranteeing precise alignment. Lastly, the product's width measures 6mm, adding to its overall dimensions.
W25Q512JVBIM Features
Package / Case: 24-TBGA
W25Q512JVBIM Applications
There are a lot of Winbond Electronics
W25Q512JVBIM Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
W25Q512JVBIM More Descriptions
R-PBGA-B24 Surface Mount Tray 64MX8 ic memory 133MHz 6mm 536870912bit 2.7V
TFBGA-24(6x8) NOR FLASH ROHS
IC FLSH 512MBIT SPI/QUAD 24TFBGA
TFBGA-24(6x8) NOR FLASH ROHS
IC FLSH 512MBIT SPI/QUAD 24TFBGA
The three parts on the right have similar specifications to W25Q512JVBIM.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchReach Compliance CodeJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityParallel/SerialProgramming VoltageAlternate Memory WidthHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsPublishedECCN CodePin CountPower SuppliesInterfaceNominal Supply CurrentAccess TimeWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionRadiation HardeningView Compare
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W25Q512JVBIM10 WeeksSurface Mount24-TBGAYES-40°C~85°C TATraySpiFlash®Active3 (168 Hours)24FLASH - NOR2.7V~3.6VBOTTOM13V1mmcompliantR-PBGA-B243.6V2.7V512Mb 64M x 8Non-VolatileSYNCHRONOUS133MHzFLASHSPI - Quad I/O64MX88536870912 bitSERIAL3V11.2mm8mm6mmRoHS Compliant---------------------
-
-Surface Mount8-WDFN Exposed Pad--40°C~85°C TATubeSpiFlash®Discontinued3 (168 Hours)8FLASH - NOR2.7V~3.6VDUAL13V1.27mm--3.6V2.7V128Mb 16M x 8Non-Volatile-104MHzFLASHSPI - Quad I/O, QPI-1--3V----ROHS3 CompliantSurface Mount820163A991.B.1.A83/3.3VSPI, Serial20mA7 ns50μs, 3ms24b128 Mb0.00002ASynchronous8bSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARENo
-
10 WeeksSurface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V--------128Mb 16M x 8Non-Volatile-133MHzFLASHSPI - Quad I/O, QPI, DTR---------ROHS3 Compliant--2016------3ms----------
-
10 WeeksSurface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V--------128Mb 16M x 8Non-Volatile-133MHzFLASHSPI - Quad I/O, QPI, DTR---------ROHS3 Compliant---------3ms----------
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