Winbond Electronics W25Q16DVZPIG
- Part Number:
- W25Q16DVZPIG
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 7085262-W25Q16DVZPIG
- Description:
- 3/3.3V V SpiFlash® Memory IC SpiFlash® Series 16 Mb kb 6mm mm 18mA mA 8b b
- Datasheet:
- W25Q16DVZPIG
Winbond Electronics W25Q16DVZPIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q16DVZPIG.
- Factory Lead Time14 Weeks
- Mounting TypeSurface Mount
- Package / Case8-WDFN Exposed Pad
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTube
- Published2012
- SeriesSpiFlash®
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN Code3A991.B.1.A
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1.27mm
- JESD-30 CodeR-PDSO-N8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- InterfaceSPI, Serial
- Memory Size16Mb 2M x 8
- Nominal Supply Current18mA
- Memory TypeNon-Volatile
- Clock Frequency104MHz
- Access Time7 ns
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O
- Organization2MX8
- Memory Width8
- Write Cycle Time - Word, Page50μs, 3ms
- Address Bus Width24b
- Density16 Mb
- Standby Current-Max0.000005A
- Sync/AsyncSynchronous
- Word Size8b
- Programming Voltage2.7V
- Serial Bus TypeSPI
- Endurance100000 Write/Erase Cycles
- Data Retention Time-Min20
- Write ProtectionHARDWARE/SOFTWARE
- Height Seated (Max)0.8mm
- Length6mm
- RoHS StatusROHS3 Compliant
W25Q16DVZPIG Overview
Winbond Electronics offers a Memory electronic component under its brand. This specific product falls under the Memory category. The mounting type is surface mount, while it comes in a tube packaging. Currently, the part has been discontinued. The moisture sensitivity level (MSL) stands at 3 (168 hours). It features 8 terminations with a dual terminal position. The power supply requirements are 3/3.3V. The memory width is 8, density stands at 16 Mb, and the maximum standby current stands at 0.000005A.
W25Q16DVZPIG Features
Package / Case: 8-WDFN Exposed Pad
W25Q16DVZPIG Applications
There are a lot of Winbond Electronics
W25Q16DVZPIG Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Winbond Electronics offers a Memory electronic component under its brand. This specific product falls under the Memory category. The mounting type is surface mount, while it comes in a tube packaging. Currently, the part has been discontinued. The moisture sensitivity level (MSL) stands at 3 (168 hours). It features 8 terminations with a dual terminal position. The power supply requirements are 3/3.3V. The memory width is 8, density stands at 16 Mb, and the maximum standby current stands at 0.000005A.
W25Q16DVZPIG Features
Package / Case: 8-WDFN Exposed Pad
W25Q16DVZPIG Applications
There are a lot of Winbond Electronics
W25Q16DVZPIG Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
W25Q16DVZPIG More Descriptions
3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | IC FLASH 16M SPI 104MHZ 8WSON
3A991.B.1.A Surface Mount Tube 2MX8 ic memory 104MHz 7ns 6mm 18mA
NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Flash ; 16M bit (90nm) WSON 6*5 mm Rev:D
IC FLASH 16MBIT SPI/QUAD 8WSON
Product Description Demo for Development.
3A991.B.1.A Surface Mount Tube 2MX8 ic memory 104MHz 7ns 6mm 18mA
NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Flash ; 16M bit (90nm) WSON 6*5 mm Rev:D
IC FLASH 16MBIT SPI/QUAD 8WSON
Product Description Demo for Development.
The three parts on the right have similar specifications to W25Q16DVZPIG.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceMemory SizeNominal Supply CurrentMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeProgramming VoltageSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionHeight Seated (Max)LengthRoHS StatusMountNumber of PinsPin CountRadiation HardeningView Compare
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W25Q16DVZPIG14 WeeksSurface Mount8-WDFN Exposed PadYES-40°C~85°C TATube2012SpiFlash®Discontinued3 (168 Hours)83A991.B.1.A8542.32.00.51FLASH - NOR2.7V~3.6VDUAL13V1.27mmR-PDSO-N8Not Qualified3.6V3/3.3V2.7VSPI, Serial16Mb 2M x 818mANon-Volatile104MHz7 nsFLASHSPI - Quad I/O2MX8850μs, 3ms24b16 Mb0.000005ASynchronous8b2.7VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE0.8mm6mmROHS3 Compliant-----
-
-Surface Mount8-WDFN Exposed Pad--40°C~85°C TATube2016SpiFlash®Discontinued3 (168 Hours)83A991.B.1.A-FLASH - NOR2.7V~3.6VDUAL13V1.27mm--3.6V3/3.3V2.7VSPI, Serial128Mb 16M x 820mANon-Volatile104MHz7 nsFLASHSPI - Quad I/O, QPI-150μs, 3ms24b128 Mb0.00002ASynchronous8b3VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE--ROHS3 CompliantSurface Mount88No
-
10 WeeksSurface Mount24-TBGA--40°C~85°C TATape & Reel (TR)2016SpiFlash®Active3 (168 Hours)---FLASH - NOR2.7V~3.6V----------128Mb 16M x 8-Non-Volatile133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms------------ROHS3 Compliant----
-
10 WeeksSurface Mount24-TBGA--40°C~85°C TATape & Reel (TR)-SpiFlash®Active3 (168 Hours)---FLASH - NOR2.7V~3.6V----------128Mb 16M x 8-Non-Volatile133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms------------ROHS3 Compliant----
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