TX7332ZBX

Texas Instruments TX7332ZBX

Part Number:
TX7332ZBX
Manufacturer:
Texas Instruments
Ventron No:
7506162-TX7332ZBX
Description:
TX7332ZBX datasheet pdf and RF Transmitters product details from Texas Instruments stock available at Ventron
ECAD Model:
Datasheet:
TX7332ZBX

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Texas Instruments TX7332ZBX technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TX7332ZBX.
  • Factory Lead Time
    6 Weeks
  • Package / Case
    260-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C
  • Series
    TX7332
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    260
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Applications
    Ultrasound Imaging
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Number of Functions
    1
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B260
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Data Interface
    SPI
  • Length
    17mm
  • Height Seated (Max)
    1.65mm
  • Width
    11mm
  • RoHS Status
    RoHS Compliant
Description
TX7332ZBX Description
A highly integrated, high-performance transmitter for an ultrasound imaging system is the TX7332ZBX. The system supports both on-chip and off-chip beamformers and contains a total of 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and (TxBF). Additionally, the gadget includes on-chip floating power supplies that cut down on the amount of high voltage power supplies needed.

TX7332ZBX Features
On-chip beamformer with:
– Delay resolution: one beamformer clock period – Maximum delay: 2'13 beamformer clock period – Maximum beamformer clock speed: 200 MHz – On-chip RAM to store – 16 delay profiles – 32 pattern profiles High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
Automatic thermal shutdown
No specific power sequencing requirement
Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch
TX7332 supports:
– 32-channel three-level pulser and active transmit/receive (T/R) switch – Very low power on-chip beamforming mode:   – In receive-only mode: 0.45 mW/ch   – In transmit-receive mode: 16.4 mW/ch   – In CW mode: 160 mW/ch   – In global power-down mode: 0.1 mW/ch Three-level pulser:
– Maximum output voltage: ±100 V – Minimum output voltage: ±1 V – Maximum output current: 1.2 A to 0.3 A – Maximum clamp current: 0.5 A to 0.12 A – Second harmonic : –45 dBc at 5 MHz – CW mode jitter: 100 fs measured from 100 Hz to 20 kHz – CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal – –3-dB bandwidth with 2-kΩ || 120-pF load   – 20 MHz (for ±100-V supply)   – 25 MHz (for ±70-V supply) Active T/R switch with:
– ON, OFF control signals – Bandwidth: 50 MHz – HD2: –50 dBc – Turnon resistance: 24 Ω – Turnon time: 0.5 µs – Turnoff time: 1.75 µs – Transient glitch: 50 mVPP Off-chip beamformer with:
– Jitter cleaning using synchronization feature – Maximum synchronization clock frequency: 200 MHz

TX7332ZBX Applications
Ultrasound imaging system
Piezoelectric driver
In-probe ultrasound imaging
TX7332ZBX More Descriptions
32-channel 3-level transmitter with integrated transmit beamformer 260-NFBGA 0 to 70
Analog Front End IC 32-Channel Transmitter 260-Pin NFBGA Surface Mount
AFE Ultrasound 260-Pin NFBGA Tray
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.