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NT2L1001G0DUFV

NXP USA Inc. NT2L1001G0DUFV

Part Number:
NT2L1001G0DUFV
Manufacturer:
NXP USA Inc.
Ventron No:
8291786-NT2L1001G0DUFV
Description:
NT2L1001G0DUFV datasheet pdf and RFID, RF Access, Monitoring ICs product details from NXP USA Inc. stock available at Ventron
ECAD Model:
Datasheet:
NT2L1001G0DUFV

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Specifications
NXP USA Inc. NT2L1001G0DUFV technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. NT2L1001G0DUFV.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    Die
  • Operating Temperature
    -25°C~70°C TA
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Frequency
    13.56MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Standards
    ISO 14443, NFC
  • RoHS Status
    ROHS3 Compliant
Description
NT2L1001G0DUFV Overview
This product is manufactured by NXP USA Inc. and belongs to the category of RFID, RF Access, Monitoring ICs. The images we provide are for reference only, for detailed product information please see specification sheet NT2L1001G0DUFV or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of NT2L1001G0DUFV. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
NT2L1001G0DUFV More Descriptions
NTAG 210u, NFC Forum Type 2 Tag compliant IC with 48 bytes, RoHSNXP Semiconductors SCT
IC RFID READR/TRAN 13.56MZ WAFER
NT2L1001G0DUF/UNCASED/NO MARK
Product Comparison
The three parts on the right have similar specifications to NT2L1001G0DUFV.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Part Status
    Moisture Sensitivity Level (MSL)
    Peak Reflow Temperature (Cel)
    Frequency
    Time@Peak Reflow Temperature-Max (s)
    Standards
    RoHS Status
    Packaging
    Published
    View Compare
  • NT2L1001G0DUFV
    NT2L1001G0DUFV
    NXP USA Inc.
    13 Weeks
    Surface Mount
    Die
    -25°C~70°C TA
    Active
    Not Applicable
    NOT SPECIFIED
    13.56MHz
    NOT SPECIFIED
    ISO 14443, NFC
    ROHS3 Compliant
    -
    -
    -
  • NT2L1011G0DUFV
    NT2L1011G0DUFV
    NXP USA Inc.
    8 Weeks
    Surface Mount
    Die
    -25°C~70°C
    Active
    Not Applicable
    -
    13.56MHz
    -
    ISO 14443
    ROHS3 Compliant
    Bulk
    2012
    NT2L1001G0DUFV vs NT2L1011G0DUFV
  • NT2L1011G0DUDV
    NT2L1011G0DUDV
    NXP USA Inc.
    16 Weeks
    Surface Mount
    Die
    -25°C~70°C
    Active
    Not Applicable
    -
    13.56MHz
    -
    ISO 14443
    ROHS3 Compliant
    Bulk
    2012
    NT2L1001G0DUFV vs NT2L1011G0DUDV
  • NT2L1211G0DUDV
    NT2L1211G0DUDV
    NXP USA Inc.
    16 Weeks
    Surface Mount
    Die
    -25°C~70°C
    Active
    Not Applicable
    -
    13.56MHz
    -
    ISO 14443
    ROHS3 Compliant
    Bulk
    2012
    NT2L1001G0DUFV vs NT2L1211G0DUDV
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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